Inventor · disambiguated record
Makoto Terui
Also filed as: TERUI MAKOTO
71 granted patents·15 pending applications·955 citations·filing 1997–2019
99Inventor score
Top patents by PatentIndex Score
86 records- 0196US6608375B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2001·Granted Aug 19, 2003·63 cites·15 claims
- 0296US6538319B2Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2001·Granted Mar 25, 2003·100 cites·22 claims
- 0394US9431347B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 30, 2016·28 cites·20 claims
- 0494US6472732B1BGA package and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2000·Granted Oct 29, 2002·93 cites·17 claims
- 0593US6225694B1Semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1998·Granted May 1, 2001·123 cites·20 claims
- 0691US7459765B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2007·Granted Dec 2, 2008·13 cites·5 claims
- 0789US9425159B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2014·Granted Aug 23, 2016·12 cites·20 claims
- 0889US6534879B2Semiconductor chip and semiconductor device having the chipOKI ELECTRIC IND CO LTD·Filed 2001·Granted Mar 18, 2003·56 cites·36 claims
- 0988US8409930B2Semiconductor device manufacturing methodTERUI MAKOTO·Filed 2011·Granted Apr 2, 2013·10 cites·20 claims
- 1088US7380915B2Ink jet recording head and producing method thereforCANON KK·Filed 2005·Granted Jun 3, 2008·9 cites·3 claims
- 1188US7063799B2Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufactureCANON KK·Filed 2003·Granted Jun 20, 2006·29 cites·14 claims
- 1288US6467884B1Substrate unit for liquid discharging head, method for producing the same, liquid discharging head, cartridge, and image forming apparatusCANON KK·Filed 2000·Granted Oct 22, 2002·33 cites·25 claims
- 1388US6390606B1Ink-jet head, ink-jet head substrate, and a method for making the headCANON KK·Filed 1999·Granted May 21, 2002·57 cites·19 claims
- 1487US9832878B2Wiring board with cavity for built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Nov 28, 2017·5 cites·20 claims
- 1586US7452474B2Method of manufacturing substrate for ink jet recording head and method of manufacturing recording head using substrate manufactured by this methodCANON KK·Filed 2005·Granted Nov 18, 2008·8 cites·54 claims
- 1685US7517058B2Ink jet recording head having structural members in ink supply portCANON KK·Filed 2006·Granted Apr 14, 2009·7 cites·3 claims
- 1785US7012339B2Semiconductor chip with passive element in a wiring region of the chipOKI ELECTRIC IND CO LTD·Filed 2003·Granted Mar 14, 2006·36 cites·5 claims
- 1884US8205967B2Liquid ejection head and manufacturing method thereofUYAMA MASAYA·Filed 2009·Granted Jun 26, 2012·7 cites·3 claims
- 1983US9706663B2Printed wiring board, method for manufacturing the same and semiconductor deviceIBIDEN CO LTD·Filed 2015·Granted Jul 11, 2017·4 cites·18 claims
- 2080US7687283B2Method of producing a semiconductor device having a magnetic layer formed thereonOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Mar 30, 2010·9 cites·5 claims
- 2179US9066435B2Wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Jun 23, 2015·4 cites·20 claims
- 2279US8018055B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2010·Granted Sep 13, 2011·2 cites·3 claims
- 2379US7932597B2Semiconductor device and manufacturing method thereofOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Apr 26, 2011·7 cites·20 claims
- 2479US7696009B2Method for fabricating a semiconductor device having a heat radiation layerOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Apr 13, 2010·5 cites·12 claims
- 2579US7545036B2Semiconductor device that suppresses variations in high frequency characteristics of circuit elementsOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Jun 9, 2009·6 cites·9 claims
- 2678US10471750B2Printing apparatus, liquid absorbing apparatus, control methodCANON KK·Filed 2018·Granted Nov 12, 2019·1 cites·20 claims
- 2778US7753495B2Ink jet recording head, manufacturing method therefor, and substrate for ink jet recording head manufactureCANON KK·Filed 2006·Granted Jul 13, 2010·4 cites·5 claims
- 2877US7211883B2Semiconductor chip packageOKI ELECTRIC IND CO LTD·Filed 2005·Granted May 1, 2007·7 cites·10 claims
- 2975US8755196B2Wiring board and method for manufacturing the sameOUCHI SHINJI·Filed 2011·Granted Jun 17, 2014·5 cites·20 claims
- 3075US6952048B2Semiconductor device with improved design freedom of external terminalOKI ELECTRIC IND CO LTD·Filed 2003·Granted Oct 4, 2005·21 cites·14 claims
- 3175US6707146B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2002·Granted Mar 16, 2004·11 cites·22 claims
- 3274US7928546B2Semiconductor device and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2007·Granted Apr 19, 2011·6 cites·5 claims
- 3373US7998555B2Beam, ink jet recording head having beams, and method for manufacturing ink jet recording head having beamsCANON KK·Filed 2010·Granted Aug 16, 2011·1 cites·7 claims
- 3473US7416285B2Method for manufacturing a filter substrate, inkjet recording head, and method for manufacturing the inkjet recording headCANON KK·Filed 2005·Granted Aug 26, 2008·4 cites·2 claims
- 3571US9102150B2Liquid ejection head and method for manufacturing sameCANON KK·Filed 2014·Granted Aug 11, 2015·1 cites·13 claims
- 3670US9723728B2Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Aug 1, 2017·2 cites·20 claims
- 3770US6060774ASemiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1997·Granted May 9, 2000·37 cites·20 claims
- 3869US7102227B2Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2004·Granted Sep 5, 2006·13 cites·18 claims
- 3968US6806564B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2004·Granted Oct 19, 2004·7 cites·5 claims
- 4068US6582053B1Method for manufacturing a liquid jet recording head and a liquid jet recording head manufactured by such methodCANON KK·Filed 2000·Granted Jun 24, 2003·11 cites·6 claims
- 4167US7632711B2Fabrication method for chip size package and non-chip size package semiconductor devicesOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Dec 15, 2009·3 cites·16 claims
- 4267US7511351B2Semiconductor device and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2005·Granted Mar 31, 2009·3 cites·3 claims
- 4367US7078265B2Method for fabricating a semiconductor device having a heat radiation layer including forming scribe lines and dicingOKI ELECTRIC IND CO LTD·Filed 2003·Granted Jul 18, 2006·9 cites·21 claims
- 4466US9613893B2Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 4566US7926909B2Ink-jet recording head, method for manufacturing ink-jet recording head, and semiconductor deviceCANON KK·Filed 2008·Granted Apr 19, 2011·2 cites·7 claims
- 4666US7714434B2Semiconductor apparatus with decoupling capacitorOKI ELECTRIC IND CO LTD·Filed 2008·Granted May 11, 2010·1 cites·1 claims
- 4766US6869168B2Liquid ejection print headCANON KK·Filed 2001·Granted Mar 22, 2005·10 cites·19 claims
- 4864US8759691B2Wiring board and method for manufacturing the sameOUCHI SHINJI·Filed 2011·Granted Jun 24, 2014·2 cites·17 claims
- 4964US7321163B2Semiconductor device including a plurality of circuit element chips and a manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 2005·Granted Jan 22, 2008·2 cites·17 claims
- 5064US7075177B2Semiconductor chip packageOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jul 11, 2006·11 cites·17 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →