Inventor · disambiguated record
Sung Kwon Kang
Also filed as: KANG SUNG · KANG SUNG K · KANG SUNG KWON
58 granted patents·21 pending applications·2,406 citations·filing 1989–2023
99Inventor score
Files withIBM52S & G BIOTECH INC8GRUBER PETER A3CHIU GEORGE LIANG-TAI2CHONG KUN DANG PHARMACEUTICAL CORP2
Top patents by PatentIndex Score
79 records- 0199US6224690B1Flip-Chip interconnections using lead-free soldersIBM·Filed 1996·Granted May 1, 2001·191 cites·12 claims
- 0297US5937320ABarrier layers for electroplated SnPb eutectic solder jointsIBM·Filed 1998·Granted Aug 10, 1999·297 cites·18 claims
- 0397US5134460AAluminum bump, reworkable bump, and titanium nitride structure for tab bondingIBM·Filed 1990·Granted Jul 28, 1992·265 cites·15 claims
- 0496US6337522B1Structure employing electrically conductive adhesivesIBM·Filed 1998·Granted Jan 8, 2002·114 cites·15 claims
- 0596US6114413AThermally conducting materials and applications for microelectronic packagingIBM·Filed 1998·Granted Sep 5, 2000·149 cites·29 claims
- 0695US6600224B1Thin film attachment to laminate using a dendritic interconnectionIBM·Filed 2000·Granted Jul 29, 2003·83 cites·19 claims
- 0794US5185073AMethod of fabricating nendritic materialsIBM·Filed 1991·Granted Feb 9, 1993·173 cites·4 claims
- 0893US6805974B2Lead-free tin-silver-copper alloy solder compositionIBM·Filed 2002·Granted Oct 19, 2004·59 cites·73 claims
- 0993US6238599B1High conductivity, high strength, lead-free, low cost, electrically conducting materials and applicationsIBM·Filed 1997·Granted May 29, 2001·90 cites·10 claims
- 1091US6698077B2Display fabrication using modular active devicesIBM·Filed 2000·Granted Mar 2, 2004·39 cites·22 claims
- 1191US5137461ASeparable electrical connection technologyIBM·Filed 1990·Granted Aug 11, 1992·134 cites·8 claims
- 1289US5837119AMethods of fabricating dendritic powder materials for high conductivity paste applicationsIBM·Filed 1996·Granted Nov 17, 1998·60 cites·28 claims
- 1388US5296189AMethod for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewithIBM·Filed 1992·Granted Mar 22, 1994·39 cites·28 claims
- 1487US7452568B2Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formationIBM·Filed 2005·Granted Nov 18, 2008·15 cites·1 claims
- 1587US7079393B2Fluidic cooling systems and methods for electronic componentsIBM·Filed 2004·Granted Jul 18, 2006·44 cites·21 claims
- 1687US6300164B1Structure, materials, and methods for socketable ball gridIBM·Filed 2000·Granted Oct 9, 2001·42 cites·16 claims
- 1785US6879098B2Display fabrication using modular active devicesIBM·Filed 2004·Granted Apr 12, 2005·24 cites·8 claims
- 1884US6297559B1Structure, materials, and applications of ball grid array interconnectionsIBM·Filed 1998·Granted Oct 2, 2001·55 cites·42 claims
- 1984US5958590ADendritic powder materials for high conductivity paste applicationsIBM·Filed 1995·Granted Sep 28, 1999·72 cites·8 claims
- 2083US6551931B1Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so cappedIBM·Filed 2000·Granted Apr 22, 2003·27 cites·23 claims
- 2179US6646355B2Structure comprising beam leads bonded with electrically conductive adhesiveIBM·Filed 2002·Granted Nov 11, 2003·20 cites·11 claims
- 2277US9082762B2Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clipKANG SUNG K·Filed 2009·Granted Jul 14, 2015·9 cites·31 claims
- 2377US8157158B2Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2007·Granted Apr 17, 2012·5 cites·12 claims
- 2477US7273803B2Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structureIBM·Filed 2003·Granted Sep 25, 2007·16 cites·14 claims
- 2576US6059952AMethod of fabricating coated powder materials and their use for high conductivity paste applicationsIBM·Filed 1998·Granted May 9, 2000·51 cites·41 claims
- 2675US6784088B2Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so cappedIBM·Filed 2003·Granted Aug 31, 2004·16 cites·10 claims
- 2774US8026613B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2008·Granted Sep 27, 2011·4 cites·6 claims
- 2874US7410833B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2004·Granted Aug 12, 2008·14 cites·18 claims
- 2974US6555762B2Electronic package having substrate with electrically conductive through holes filled with polymer and conductive compositionIBM·Filed 1999·Granted Apr 29, 2003·38 cites·3 claims
- 3073US5855993AElectronic devices having metallurgies containing copper-semiconductor compoundsIBM·Filed 1994·Granted Jan 5, 1999·49 cites·20 claims
- 3171US7923849B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2008·Granted Apr 12, 2011·3 cites·9 claims
- 3271US6322685B1Apparatus and method for plating coatings on to fine powder materials and use of the powder therefromIBM·Filed 1998·Granted Nov 27, 2001·32 cites·40 claims
- 3365US9867704B2Cardiac valve fixing devicePUSAN NATIONAL UNIV INDUSTRY-UNIV COOPERATION FOUNDATION·Filed 2014·Granted Jan 16, 2018·8 cites·15 claims
- 3465US8314500B2Interconnections for flip-chip using lead-free solders and having improved reaction barrier layersBELANGER LUC·Filed 2006·Granted Nov 20, 2012·4 cites·1 claims
- 3565US7523852B2Solder interconnect structure and method using injection molded solderIBM·Filed 2004·Granted Apr 28, 2009·11 cites·13 claims
- 3665US5135155AThermocompression bonding in integrated circuit packagingIBM·Filed 1991·Granted Aug 4, 1992·34 cites·16 claims
- 3764US6120885AStructure, materials, and methods for socketable ball gridIBM·Filed 1998·Granted Sep 19, 2000·25 cites·18 claims
- 3863US7815968B2Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formationIBM·Filed 2008·Granted Oct 19, 2010·2 cites·46 claims
- 3960US7820488B2Microelectronic devices and methodsIBM·Filed 2007·Granted Oct 26, 2010·1 cites·12 claims
- 4060US7784669B2Method and process for reducing undercooling in a lead-free tin-rich solder alloyIBM·Filed 2009·Granted Aug 31, 2010·1 cites·11 claims
- 4160US5006917AThermocompression bonding in integrated circuit packagingIBM·Filed 1989·Granted Apr 9, 1991·25 cites·10 claims
- 4259US7932169B2Interconnection for flip-chip using lead-free solders and having improved reaction barrier layersIBM·Filed 2009·Granted Apr 26, 2011·1 cites·3 claims
- 4359US7703661B2Method and process for reducing undercooling in a lead-free tin-rich solder alloyIBM·Filed 2007·Granted Apr 27, 2010·1 cites·22 claims
- 4457US2024325181A1Stent delivery deviceS&G BIOTECH INC·Filed 2023·Application pending·0 cites
- 4556US9433101B2Substrate via fillingIBM·Filed 2014·Granted Aug 30, 2016·0 cites·1 claims
- 4656US2012205425A1Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2012·Application pending·0 cites
- 4756US2012201596A1Modification of solder alloy compositions to suppress interfacial void formation in solder jointsGRUBER PETER A·Filed 2012·Application pending·0 cites
- 4854US2023399298A1Acid addition salt of indene derivative prodrug and method for preparing sameCHONG KUN DANG PHARMACEUTICAL CORP·Filed 2021·Application pending·0 cites
- 4953US2008274349A1Multipath Soldered Thermal Interface Between a Chip and its Heat SinkIBM·Filed 2008·Application pending·0 cites
- 5052US9872394B2Substrate via fillingIBM·Filed 2016·Granted Jan 16, 2018·0 cites·18 claims
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →