Inventor · disambiguated record
Kuan Ming Kan
Also filed as: KAN KUAN MING
3 granted patents·25 citations·filing 2000–2006
68Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0177US7598600B2Stackable power semiconductor package systemSTATS CHIPPAC LTD·Filed 2006·Granted Oct 6, 2009·12 cites·4 claims
- 0272US7557432B2Thermally enhanced power semiconductor package systemSTATS CHIPPAC LTD·Filed 2006·Granted Jul 7, 2009·8 cites·20 claims
- 0346US6436736B1Method for manufacturing a semiconductor package on a leadframeSEMICONDUCTOR COMPONENTS IND·Filed 2000·Granted Aug 20, 2002·5 cites·6 claims
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