Inventor · disambiguated record
Inetaro Kurosawa
Also filed as: KUROSAWA INETARO
1 granted patent·5 pending applications·0 citations·filing 2002–2010
13Inventor score
Top patents by PatentIndex Score
6 records- 0138US2008136041A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 0235US2008128288A1Method of manufacturing a multi-layer wiring board using a metal member having a rough surfaceTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 0334US2007221329A1Apparatus and method for distributing a liquid onto a surface of an itemTESSERA INTERCONNECT MATERIALS·Filed 2006·Application pending·0 cites
- 0433US2008169568A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 0532US2005097727A1Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring boardFiled 2002·Application pending·0 cites
- 0631US8736064B2Structure and method of making interconnect element having metal traces embedded in surface of dielectricKOTAKE HIDEKI·Filed 2010·Granted May 27, 2014·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →