Inventor · disambiguated record
Tomoya Daizo
Also filed as: DAIZO TOMOYA
4 granted patents·4 pending applications·1 citations·filing 2014–2024
55Inventor score
Files withIBIDEN CO LTD8
Top patents by PatentIndex Score
8 records- 0180US11622446B2Wiring substrateIBIDEN CO LTD·Filed 2021·Granted Apr 4, 2023·1 cites·20 claims
- 0254US2024260197A1Wiring substrateIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 0352US12033927B2Method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 0449US11935822B2Wiring substrate having metal post offset from conductor pad and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 0546US2022013455A1Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2021·Application pending·0 cites
- 0643US2015156880A1Printed wiring board and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 0742US2021257224A1Method for manufacturing wiring substrate, and wiring substrateIBIDEN CO LTD·Filed 2021·Application pending·0 cites
- 0835US9401320B2Combined substrateIBIDEN CO LTD·Filed 2015·Granted Jul 26, 2016·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Tomoya Daizo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →