Inventor · disambiguated record
Chao-Fu Weng
Also filed as: WENG CHAO-FU
33 granted patents·20 pending applications·404 citations·filing 2002–2015
97Inventor score
Top patents by PatentIndex Score
53 records- 0195US8288854B2Semiconductor package and method for making the sameWENG CHAO-FU·Filed 2010·Granted Oct 16, 2012·76 cites·13 claims
- 0291US7253519B2Chip packaging structure having redistribution layer with recessADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·57 cites·18 claims
- 0381US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 0479US6720243B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·27 cites·13 claims
- 0577US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 0675US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 0774US9955590B2Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Apr 24, 2018·2 cites·13 claims
- 0873US7547575B2Two-stage die-bonding method for simultaneous die-bonding of multiple diesADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 16, 2009·7 cites·6 claims
- 0972US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 1071US6827252B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·18 cites·39 claims
- 1170US6921716B2Wafer bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jul 26, 2005·16 cites·21 claims
- 1270US6867122B2Redistribution processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 15, 2005·16 cites·10 claims
- 1369US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 1468US7445944B2Packaging substrate and manufacturing method thereofASE SHANGHAI INC·Filed 2006·Granted Nov 4, 2008·5 cites·14 claims
- 1563US6812124B2Chip structure with bumps and a process for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Nov 2, 2004·9 cites·5 claims
- 1661US6989326B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 24, 2006·10 cites·24 claims
- 1760US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 1856US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
- 1956US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 2055US7581666B2Wire-bonding method for wire-bonding apparatusADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 1, 2009·1 cites·6 claims
- 2155US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
- 2255US7015130B2Method for making UBM pads and bumps on waferADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 21, 2006·9 cites·18 claims
- 2353US6927964B2Structure for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 9, 2005·4 cites·9 claims
- 2450US6875683B2Method of forming bumpADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 5, 2005·4 cites·29 claims
- 2550US6716739B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 6, 2004·4 cites·112 claims
- 2649US2007252275A1Chip packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2748US8431007B2Electro-thinning apparatus for removing excess metal from surface metal layer of substrate and removing method using the sameTARNG SHIN-LUH·Filed 2009·Granted Apr 30, 2013·0 cites·18 claims
- 2848US6967153B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 22, 2005·2 cites·27 claims
- 2948US6743707B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 1, 2004·3 cites·10 claims
- 3048US2005016859A1[process for fabricating bumps]Filed 2004·Application pending·0 cites
- 3147US6756256B2Method for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 29, 2004·2 cites·8 claims
- 3246US6877653B2Method of modifying tin to lead ratio in tin-lead bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·1 cites·15 claims
- 3345US7261828B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 28, 2007·2 cites·17 claims
- 3445US6713320B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 30, 2004·1 cites·20 claims
- 3545US2003155231A1Field adjusting apparatus for an electroplating bathFiled 2003·Application pending·0 cites
- 3644US2010200974A1Semiconductor package structure using the sameWENG CHAO-FU·Filed 2009·Application pending·0 cites
- 3741US2008044931A1Packaging substrate and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 3841US2005023678A1Chip structure with bumps and a process for fabricating the sameFiled 2004·Application pending·0 cites
- 3941US2006017171A1Formation method and structure of conductive bumpsADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 4040US2005161812A1Wafer-level package structureFiled 2005·Application pending·0 cites
- 4140US2008035706A1Wire-bonding apparatus and wire-bonding method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 4239US7144801B2Bumping process to increase bump heightADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Dec 5, 2006·0 cites·20 claims
- 4339US2003161123A1Bonding structure for bonding substrates by metal studsFiled 2003·Application pending·0 cites
- 4439US2003189260A1Flip-chip bonding structure and method thereofFiled 2003·Application pending·0 cites
- 4538US2004256737A1[flip-chip package substrate and flip-chip bonding process thereof]Filed 2004·Application pending·0 cites
- 4638US2003146191A1Etching method for nickel-vanadium alloyFiled 2003·Application pending·0 cites
- 4738US2004183195A1[under bump metallurgy layer]Filed 2004·Application pending·0 cites
- 4837US2003157791A1Process of fabricating bumpsFiled 2003·Application pending·0 cites
- 4937US2003157438A1Bump forming processFiled 2003·Application pending·0 cites
- 5037US2003189261A1Under-bump-metallurgy layerFiled 2003·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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