Inventor · disambiguated record
Jen-Kuang Fang
Also filed as: FANG JEN-KUANG
48 granted patents·21 pending applications·476 citations·filing 1999–2018
98Inventor score
Top patents by PatentIndex Score
69 records- 0191US7041534B2Semiconductor chip package and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 9, 2006·70 cites·10 claims
- 0285US10224301B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 5, 2019·4 cites·18 claims
- 0385US6820329B2Method of manufacturing multi-chip stacking packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Nov 23, 2004·25 cites·2 claims
- 0481US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 0580US10566279B2Package device, semiconductor device, and method for manufacturing the package deviceADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 18, 2020·4 cites·20 claims
- 0677US6861346B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 1, 2005·21 cites·20 claims
- 0776US10269672B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 23, 2019·2 cites·32 claims
- 0875US11024569B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 1, 2021·2 cites·10 claims
- 0975US7262497B2Bumpless assembly packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 28, 2007·21 cites·26 claims
- 1075US6673711B2Solder ball fabricating processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 6, 2004·19 cites·21 claims
- 1172US7384566B2Fabrication method for printed circuit boardADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jun 10, 2008·7 cites·10 claims
- 1272US6737353B2Semiconductor device having bump electrodesADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted May 18, 2004·24 cites·5 claims
- 1372US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 1472US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 1571US6933616B2Multi-chip module packaging device using flip-chip bonding technologyADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Aug 23, 2005·17 cites·11 claims
- 1671US6827252B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 7, 2004·18 cites·39 claims
- 1770US6713870B2Wafer level chip-scale packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Mar 30, 2004·16 cites·8 claims
- 1869US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 1968US7726544B2Method of packaging flip chip and method of forming pre-solders on substrate thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jun 1, 2010·6 cites·20 claims
- 2066US6916732B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 12, 2005·11 cites·21 claims
- 2165US6878963B2Device for testing electrical characteristics of chipsADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 12, 2005·12 cites·16 claims
- 2261US6989326B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 24, 2006·10 cites·24 claims
- 2360US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 2457US7375020B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 20, 2008·6 cites·10 claims
- 2557US6153939AFlip-chip semiconductor device with enhanced reliability and manufacturing efficiency, and the method for under filling the sameADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Nov 28, 2000·22 cites·6 claims
- 2656US6723630B2Solder ball fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 20, 2004·7 cites·19 claims
- 2756US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 2855US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
- 2954US6469399B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Oct 22, 2002·6 cites·10 claims
- 3053US6927964B2Structure for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 9, 2005·4 cites·9 claims
- 3151US6838311B2Flip chip package and method for forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jan 4, 2005·4 cites·3 claims
- 3250US10672696B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 2, 2020·0 cites·23 claims
- 3350US10636745B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Apr 28, 2020·0 cites·20 claims
- 3450US6875683B2Method of forming bumpADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 5, 2005·4 cites·29 claims
- 3550US6716739B2Bump manufacturing methodADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Apr 6, 2004·4 cites·112 claims
- 3648US6967153B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 22, 2005·2 cites·27 claims
- 3748US6743707B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 1, 2004·3 cites·10 claims
- 3847US6756256B2Method for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 29, 2004·2 cites·8 claims
- 3946US9748196B2Semiconductor package structure including die and substrate electrically connected through conductive segmentsADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 29, 2017·0 cites·20 claims
- 4046US6877653B2Method of modifying tin to lead ratio in tin-lead bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·1 cites·15 claims
- 4145US10818636B2Substrate panel structure and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 27, 2020·0 cites·18 claims
- 4245US6972583B2Method for testing electrical characteristics of bumpsADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Dec 6, 2005·2 cites·9 claims
- 4345US6924557B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Aug 2, 2005·1 cites·6 claims
- 4445US6713320B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 30, 2004·1 cites·20 claims
- 4545US6342443B1Method and structure for forming flip chip with collapse-controlled solder bumps on a substrateADVANCED SEMICONDUCTOR ENG·Filed 1999·Granted Jan 29, 2002·11 cites·13 claims
- 4644US10685934B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 16, 2020·0 cites·17 claims
- 4744US7635610B2Multi-chip stack package and fabricating method thereofADAVNACED SEMICONDUCTOR ENGINE·Filed 2007·Granted Dec 22, 2009·0 cites·9 claims
- 4843US2005282314A1Printed circuit boards and methods for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 4942US2003099767A1Bumping process for chip scale packagingFiled 2002·Application pending·0 cites
- 5042US2005001303A1Method of manufacturing multi-chip stacking packageFiled 2004·Application pending·0 cites
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →