Inventor · disambiguated record
Gregg J. Armezzani
Also filed as: ARMEZZANI GREGG J · ARMEZZANI GREGG JOSEPH
11 granted patents·132 citations·filing 1996–2001
91Inventor score
Files withIBM11
Top patents by PatentIndex Score
11 records- 0171US6617528B2Electronic package with stacked connections and method for making sameIBM·Filed 2001·Granted Sep 9, 2003·15 cites·11 claims
- 0271US6574113B2Electronic package with stacked connections and method for making sameIBM·Filed 2001·Granted Jun 3, 2003·14 cites·9 claims
- 0369US6198634B1Electronic package with stacked connectionsIBM·Filed 1999·Granted Mar 6, 2001·29 cites·16 claims
- 0458US5818697AFlexible thin film ball grid array containing solder maskIBM·Filed 1997·Granted Oct 6, 1998·22 cites·10 claims
- 0552US6653575B2Electronic package with stacked connections and method for making sameIBM·Filed 2001·Granted Nov 25, 2003·4 cites·5 claims
- 0645US6452116B2Use of blind vias for soldered interconnections between substrates and printed wiring boardsIBM·Filed 2001·Granted Sep 17, 2002·1 cites·9 claims
- 0744US6272742B1Method of electrically connecting substrates using solder ballsIBM·Filed 1999·Granted Aug 14, 2001·9 cites·5 claims
- 0842US6281437B1Method of forming an electrical connection between a conductive member having a dual thickness substrate and a conductor and electronic package including said connectionIBM·Filed 1999·Granted Aug 28, 2001·11 cites·36 claims
- 0942US6187610B1Flexible thin film ball grid array containing solder maskIBM·Filed 1998·Granted Feb 13, 2001·10 cites·10 claims
- 1041US5884397AMethod for fabricating chip carriers and printed circuit boardsIBM·Filed 1996·Granted Mar 23, 1999·11 cites·17 claims
- 1138US6023029AUse of blind vias for soldered interconnections between substrates and printed wiring boardsIBM·Filed 1998·Granted Feb 8, 2000·6 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →