Inventor · disambiguated record
Paul S. Ho
Also filed as: HO PAUL S · HO PAUL S C · HO PAUL SIU-CHUNG · HOWARD JAMES K
9 granted patents·310 citations·filing 1975–1988
91Inventor score
Files withIBM9
Top patents by PatentIndex Score
9 records- 0192US4017890AIntermetallic compound layer in thin films for improved electromigration resistanceIBM·Filed 1975·Granted Apr 12, 1977·61 cites·17 claims
- 0287US4886681AMetal-polymer adhesion by low energy bombardmentIBM·Filed 1988·Granted Dec 12, 1989·62 cites·15 claims
- 0382US4154874AMethod for forming intermetallic layers in thin films for improved electromigration resistanceIBM·Filed 1977·Granted May 15, 1979·32 cites·13 claims
- 0476US4319264ANickel-gold-nickel conductors for solid state devicesIBM·Filed 1979·Granted Mar 9, 1982·31 cites·9 claims
- 0572US4316209AMetal/silicon contact and methods of fabrication thereofIBM·Filed 1979·Granted Feb 16, 1982·19 cites·5 claims
- 0671US4166279AElectromigration resistance in gold thin film conductorsIBM·Filed 1977·Granted Aug 28, 1979·28 cites·19 claims
- 0769US4268584ANickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbonIBM·Filed 1979·Granted May 19, 1981·23 cites·14 claims
- 0868US4720401AEnhanced adhesion between metals and polymersIBM·Filed 1986·Granted Jan 19, 1988·40 cites·17 claims
- 0959US4622205AElectromigration lifetime increase of lead base alloysIBM·Filed 1985·Granted Nov 11, 1986·14 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →