Inventor · disambiguated record
Kevin Knadle
Also filed as: KNADLE KEVIN · KNADLE KEVIN T · KNADLE KEVIN TAYLOR
14 granted patents·166 citations·filing 1998–2007
93Inventor score
Top patents by PatentIndex Score
14 records- 0192US7129732B1Substrate test apparatus and method of testing substratesENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Oct 31, 2006·26 cites·15 claims
- 0286US7596862B2Method of making a circuitized substrateIBM·Filed 2007·Granted Oct 6, 2009·8 cites·12 claims
- 0386US6596384B1Selectively roughening conductors for high frequency printed wiring boardsIBM·Filed 2002·Granted Jul 22, 2003·33 cites·9 claims
- 0475US6586683B2Printed circuit board with mixed metallurgy pads and method of fabricationIBM·Filed 2001·Granted Jul 1, 2003·15 cites·15 claims
- 0571US6962642B2Treating copper surfaces for electronic applicationsIBM·Filed 2002·Granted Nov 8, 2005·16 cites·15 claims
- 0671US6423905B1Printed wiring board with improved plated through hole fatigue lifeIBM·Filed 2000·Granted Jul 23, 2002·15 cites·6 claims
- 0768US6138893AMethod for producing a reliable BGA solder joint interconnectionIBM·Filed 1998·Granted Oct 31, 2000·26 cites·18 claims
- 0864US6672500B2Method for producing a reliable solder joint interconnectionIBM·Filed 2001·Granted Jan 6, 2004·10 cites·20 claims
- 0960US6931722B2Method of fabricating printed circuit board with mixed metallurgy padsIBM·Filed 2003·Granted Aug 23, 2005·7 cites·19 claims
- 1055US7325299B2Method of making a circuitized substrateIBM·Filed 2007·Granted Feb 5, 2008·0 cites·15 claims
- 1155US7235148B2Selectively roughening conductors for high frequency printed wiring boardsIBM·Filed 2003·Granted Jun 26, 2007·5 cites·10 claims
- 1253US6293455B1Method for producing a reliable BGA solder joint interconnectionIBM·Filed 2000·Granted Sep 25, 2001·4 cites·17 claims
- 1349US6822332B2Fine line circuitizationIBM·Filed 2002·Granted Nov 23, 2004·1 cites·10 claims
- 1444US7185428B2Method of making a circuitized substrateIBM·Filed 2003·Granted Mar 6, 2007·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →