Inventor · disambiguated record
Basab Chatterjee
Also filed as: CHATTERJEE BASAB
10 granted patents·1 pending application·124 citations·filing 1995–2014
88Inventor score
Files withTEXAS INSTRUMENTS INC6CHATTERJEE BASAB1DETWEILER SHANGTING1UNIV OHIO STATE RES FOUND1WEST JEFFREY ALAN1
Top patents by PatentIndex Score
11 records- 0183US8912076B2Crack deflector structure for improving semiconductor device robustness against saw-induced damageWEST JEFFREY ALAN·Filed 2009·Granted Dec 16, 2014·11 cites·12 claims
- 0283US8309957B2Replacement of scribeline padframe with saw-friendly designCHATTERJEE BASAB·Filed 2010·Granted Nov 13, 2012·11 cites·12 claims
- 0383US7212607B1X-ray confocal defect detection systems and methodsTEXAS INSTRUMENTS INC·Filed 2006·Granted May 1, 2007·9 cites·24 claims
- 0481US6834117B1X-ray defect detection in integrated circuit metallizationTEXAS INSTRUMENTS INC·Filed 2000·Granted Dec 21, 2004·31 cites·19 claims
- 0572US5571339AHydrogen passivated heteroepitaxial III-V photovoltaic devices grown on lattice-mismatched substrates, and processUNIV OHIO STATE RES FOUND·Filed 1995·Granted Nov 5, 1996·45 cites·23 claims
- 0666US6579798B2Processes for chemical-mechanical polishing of a semiconductor waferTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 17, 2003·13 cites·20 claims
- 0758US7727885B2Reduction of punch-thru defects in damascene processingTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 1, 2010·1 cites·23 claims
- 0857US8273523B2By-die-exposure for patterning of holes in edge dieDETWEILER SHANGTING·Filed 2006·Granted Sep 25, 2012·3 cites·18 claims
- 0953US10109597B2Crack deflector structure for improving semiconductor device robustness against saw-induced damageTEXAS INSTRUMENTS INC·Filed 2014·Granted Oct 23, 2018·0 cites·14 claims
- 1037US7598507B2Adjustable lithography blocking device and methodTEXAS INSTRUMENTS INC·Filed 2003·Granted Oct 6, 2009·0 cites·12 claims
- 1136US2005040046A1System for in situ seed layer remediationFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →