Inventor · disambiguated record
Robert J. Chroneos, Jr.
Also filed as: CHRONEOS JR ROBERT · CHRONEOS JR ROBERT J
9 granted patents·1 pending application·275 citations·filing 1996–2022
90Inventor score
Files withINTEL CORP10
Top patents by PatentIndex Score
10 records- 0193US6259039B1Surface mount connector with pins in viasINTEL CORP·Filed 1998·Granted Jul 10, 2001·110 cites·17 claims
- 0286US6440770B1Integrated circuit packageINTEL CORP·Filed 2000·Granted Aug 27, 2002·46 cites·12 claims
- 0373US5734559AStaggered bond finger design for fine pitch integrated circuit packagesINTEL CORP·Filed 1996·Granted Mar 31, 1998·47 cites·4 claims
- 0463US11881424B2Electrostatic charge measurement toolINTEL CORP·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 0561US5787575AMethod for plating a bond finger of an intergrated circuit packageINTEL CORP·Filed 1996·Granted Aug 4, 1998·28 cites·5 claims
- 0656US6043559AIntegrated circuit package which contains two in plane voltage busses and a wrap around conductive strip that connects a bond finger to one of the bussesINTEL CORP·Filed 1996·Granted Mar 28, 2000·20 cites·14 claims
- 0755US2024222178A1Enhanced electrostatic wafer chuck designsINTEL CORP·Filed 2022·Application pending·0 cites
- 0852US6031283AIntegrated circuit packageINTEL CORP·Filed 1996·Granted Feb 29, 2000·19 cites·16 claims
- 0950US6459563B1Method and apparatus for polygonal heat slugINTEL CORP·Filed 2001·Granted Oct 1, 2002·3 cites·20 claims
- 1031US6256189B1Heat slug design which facilitates mounting of discrete components on a package without losing lands or pins in the packageINTEL CORP·Filed 1996·Granted Jul 3, 2001·2 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →