Inventor · disambiguated record
Akihiko Endo
Also filed as: ENDO AKIHIKO
40 granted patents·12 pending applications·508 citations·filing 1987–2021
97Inventor score
Top patents by PatentIndex Score
52 records- 0195US7354844B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2006·Granted Apr 8, 2008·43 cites·9 claims
- 0293US7718509B2Method for producing bonded waferSUMCO CORP·Filed 2009·Granted May 18, 2010·26 cites·3 claims
- 0393US7713842B2Method for producing bonded waferSUMCO CORP·Filed 2008·Granted May 11, 2010·31 cites·4 claims
- 0493US4841545ASynchronous tracking device for direct spread spectrum receiverKYOCERA CORP·Filed 1987·Granted Jun 20, 1989·70 cites·24 claims
- 0590US7763541B2Process for regenerating layer transferred waferSUMCO CORP·Filed 2006·Granted Jul 27, 2010·19 cites·15 claims
- 0690US7442623B2Method for manufacturing bonded substrate and bonded substrate manufactured by the methodSUMCO CORP·Filed 2006·Granted Oct 28, 2008·17 cites·13 claims
- 0789US6131748AArticle display deviceKAWAJUN CO LTD·Filed 1996·Granted Oct 17, 2000·91 cites·1 claims
- 0886US7364984B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2007·Granted Apr 29, 2008·12 cites·8 claims
- 0985US5029181AAutomatic calibration device for direct spectrum spread receiverKYOCERA CORP·Filed 1990·Granted Jul 2, 1991·88 cites·6 claims
- 1084US7960225B1Method of controlling film thinning of semiconductor wafer for solid-state image sensing deviceSUMCO CORP·Filed 2010·Granted Jun 14, 2011·4 cites·6 claims
- 1181US8110486B2Method of manufacturing semiconductor wafer by forming a strain relaxation SiGe layer on an insulating layer of SOI waferMATSUMOTO KOJI·Filed 2007·Granted Feb 7, 2012·10 cites·3 claims
- 1281US7867877B2Method for manufacturing SOI waferSUMCO CORP·Filed 2005·Granted Jan 11, 2011·12 cites·13 claims
- 1379US7416960B2Method for manufacturing SOI substrateSUMCO CORP·Filed 2007·Granted Aug 26, 2008·7 cites·7 claims
- 1478US7767549B2Method of manufacturing bonded waferSUMCO CORP·Filed 2007·Granted Aug 3, 2010·8 cites·7 claims
- 1577US7736998B2Silicon-on insulator substrate and method for manufacturing the sameSUMCO CORP·Filed 2005·Granted Jun 15, 2010·11 cites·7 claims
- 1674US7858494B2Laminated substrate manufacturing method and laminated substrate manufactured by the methodSUMCO CORP·Filed 2006·Granted Dec 28, 2010·6 cites·4 claims
- 1774US7851337B2Method for producing semiconductor substrateSUMCO CORP·Filed 2007·Granted Dec 14, 2010·5 cites·3 claims
- 1867US8048767B2Bonded wafer and method for producing bonded waferSUMCO CORP·Filed 2007·Granted Nov 1, 2011·2 cites·5 claims
- 1967US7951692B2Method of producing semiconductor substrate having an SOI structureSUMCO CORP·Filed 2008·Granted May 31, 2011·3 cites·2 claims
- 2067US7494899B2Method for manufacturing semiconductor substrateSUMCO CORP·Filed 2005·Granted Feb 24, 2009·4 cites·3 claims
- 2167US7253069B2Method for manufacturing silicon-on-insulator waferSUMITOMO MITSUBISHI SILICON·Filed 2005·Granted Aug 7, 2007·2 cites·12 claims
- 2266US8173553B2Epitaxial wafer and production method thereofAOKI YOSHIRO·Filed 2009·Granted May 8, 2012·4 cites·6 claims
- 2366US7855132B2Method of manufacturing bonded waferSUMCO CORP·Filed 2008·Granted Dec 21, 2010·2 cites·9 claims
- 2463US7795117B2Method of producing semiconductor substrate having an SOI structureSUMCO CORP·Filed 2007·Granted Sep 14, 2010·2 cites·9 claims
- 2562US7927972B2Method for producing bonded waferSUMCO CORP·Filed 2009·Granted Apr 19, 2011·1 cites·4 claims
- 2660US7625808B2Method for manufacturing bonded waferSUMCO CORP·Filed 2004·Granted Dec 1, 2009·9 cites·4 claims
- 2758US7446016B2Method for producing bonded waferSUMCO CORP·Filed 2004·Granted Nov 4, 2008·8 cites·5 claims
- 2857US8003494B2Method for producing a bonded waferSUMCO CORP·Filed 2008·Granted Aug 23, 2011·1 cites·2 claims
- 2957US7790573B2Process for producing SOI substrate and process for regeneration of layer transferred wafer in the productionSUMCO CORP·Filed 2006·Granted Sep 7, 2010·1 cites·5 claims
- 3055US11506990B2Light emitting device, exposure device, and image forming apparatusFUJIFILM BUSINESS INNOVATION CORP·Filed 2021·Granted Nov 22, 2022·0 cites·17 claims
- 3155US11347160B2Light emitting device, exposure device, and image forming apparatusFUJIFILM BUSINESS INNOVATION CORP·Filed 2021·Granted May 31, 2022·0 cites·10 claims
- 3254US7713838B2SOI wafer and its manufacturing methodSUMCO CORP·Filed 2004·Granted May 11, 2010·4 cites·1 claims
- 3352US7544583B2SOI wafer and its manufacturing methodSUMCO CORP·Filed 2004·Granted Jun 9, 2009·3 cites·9 claims
- 3451US2009023272A1Method of producing bonded waferSUMCO CORP·Filed 2008·Application pending·0 cites
- 3549US2009280621A1Method Of Producing Bonded WaferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3649US2010178750A1Method for producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 3749US2007298589A1Method of producing bonded waferSUMCO CORP·Filed 2007·Application pending·0 cites
- 3848US8183133B2Method for producing semiconductor substrateMURAKAMI SATOSHI·Filed 2010·Granted May 22, 2012·0 cites·4 claims
- 3948US2010144119A1Method of producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 4047US7927957B2Method for producing bonded silicon waferSUMCO CORP·Filed 2009·Granted Apr 19, 2011·0 cites·8 claims
- 4147US2009186464A1Method for producing bonded waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 4246US8048769B2Method for producing bonded waferSUMCO CORP·Filed 2007·Granted Nov 1, 2011·0 cites·16 claims
- 4345US8330222B2Epitaxial wafer and production method thereofAOKI YOSHIRO·Filed 2012·Granted Dec 11, 2012·0 cites·1 claims
- 4445US7902043B2Method of producing bonded waferSUMCO CORP·Filed 2007·Granted Mar 8, 2011·0 cites·8 claims
- 4545US2010184270A1Method for Producing Bonded WaferSUMCO CORP·Filed 2010·Application pending·0 cites
- 4644US2009117708A1Method for manufacturing soi substrateSUMCO CORP·Filed 2007·Application pending·0 cites
- 4744US2008061452A1Bonded wafer and method of manufacturing the sameSUMCO CORP·Filed 2007·Application pending·0 cites
- 4843US8802540B2Method of manufacturing bonded waferMORIMOTO NOBUYUKI·Filed 2007·Granted Aug 12, 2014·0 cites·9 claims
- 4942US2006177991A1SOI wafer production methodMURAKAMI SATOSHI·Filed 2006·Application pending·0 cites
- 5038US2007069335A1Bonded wafer and its manufacturing methodENDO AKIHIKO·Filed 2004·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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