Inventor · disambiguated record
Hsiu-Chuan Shu
Also filed as: SHU HSIU-CHUAN
4 granted patents·1 pending application·5 citations·filing 2006–2024
64Inventor score
Top patents by PatentIndex Score
5 records- 0182US2024386183A1Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0280US12223252B2Through-silicon via in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 0373US11586797B2Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 0470US7531438B2Method of fabricating a recess channel transistorPROMOS TECHNOLOGIES INC·Filed 2006·Granted May 12, 2009·5 cites·15 claims
- 0562US10949597B2Through-silicon vias in integrated circuit packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →