Inventor · disambiguated record
Daniel A. Koos
Also filed as: KOOS DANIEL · KOOS DANIEL A
11 granted patents·1 pending application·1,282 citations·filing 1994–2011
94Inventor score
Top patents by PatentIndex Score
12 records- 0198US6234877B1Method of chemical mechanical polishingMICRON TECHNOLOGY INC·Filed 2000·Granted May 22, 2001·195 cites·8 claims
- 0298US5413941AOptical end point detection methods in semiconductor planarizing polishing processesMICRON TECHNOLOGY INC·Filed 1994·Granted May 9, 1995·353 cites·8 claims
- 0397US5934980AMethod of chemical mechanical polishingMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 10, 1999·261 cites·63 claims
- 0495US6120354AMethod of chemical mechanical polishingMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 19, 2000·135 cites·8 claims
- 0594US7531463B2Fabrication of semiconductor interconnect structureNOVELLUS SYSTEMS INC·Filed 2006·Granted May 12, 2009·31 cites·30 claims
- 0694US6099604ASlurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related theretoMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 8, 2000·131 cites·64 claims
- 0792US7972970B2Fabrication of semiconductor interconnect structureNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 5, 2011·17 cites·24 claims
- 0891US7338908B1Method for fabrication of semiconductor interconnect structure with reduced capacitance, leakage current, and improved breakdown voltageNOVELLUS SYSTEMS INC·Filed 2003·Granted Mar 4, 2008·66 cites·54 claims
- 0991US6312486B1Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related theretoMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 6, 2001·50 cites·25 claims
- 1083US8481432B2Fabrication of semiconductor interconnect structureMAYER STEVEN T·Filed 2011·Granted Jul 9, 2013·5 cites·20 claims
- 1173US5741547AMethod for depositing a film of titanium nitrideMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 21, 1998·38 cites·2 claims
- 1241US2001055941A1Method of chemical mechanical polishingMICRON TECHNOLOGY INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →