Inventor · disambiguated record
Jacques Leibovitz
Also filed as: LEIBOVITZ JACQUES
19 granted patents·1,274 citations·filing 1988–2000
96Inventor score
Top patents by PatentIndex Score
19 records- 0193US5055425AStacked solid via formation in integrated circuit systemsHEWLETT PACKARD CO·Filed 1989·Granted Oct 8, 1991·121 cites·8 claims
- 0291US6011314ARedistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumpsHEWLETT PACKARD CO·Filed 1999·Granted Jan 4, 2000·189 cites·19 claims
- 0390US5621615ALow cost, high thermal performance package for flip chips with low mechanical stress on chipHEWLETT PACKARD CO·Filed 1995·Granted Apr 15, 1997·135 cites·5 claims
- 0490US5029386AHierarchical tape automated bonding methodHEWLETT PACKARD CO·Filed 1990·Granted Jul 9, 1991·206 cites·13 claims
- 0589US5585671AReliable low thermal resistance package for high power flip clip ICsFiled 1994·Granted Dec 17, 1996·116 cites·9 claims
- 0689US5162260AStacked solid via formation in integrated circuit systemsHEWLETT PACKARD CO·Filed 1991·Granted Nov 10, 1992·124 cites·6 claims
- 0787US5199165AHeat pipe-electrical interconnect integration method for chip modulesHEWLETT PACKARD CO·Filed 1992·Granted Apr 6, 1993·98 cites·5 claims
- 0875US6085968ASolder retention ring for improved solder bump formationHEWLETT PACKARD CO·Filed 1999·Granted Jul 11, 2000·36 cites·5 claims
- 0974US5161090AHeat pipe-electrical interconnect integration for chip modulesHEWLETT PACKARD CO·Filed 1991·Granted Nov 3, 1992·53 cites·18 claims
- 1071US5484964ASurface mounting pin grid arraysFiled 1995·Granted Jan 16, 1996·50 cites·9 claims
- 1162US5221421AControlled etching process for forming fine-geometry circuit lines on a substrateHEWLETT PACKARD CO·Filed 1992·Granted Jun 22, 1993·35 cites·26 claims
- 1260US6146984AMethod and structure for uniform height solder bumps on a semiconductor waferAGILENT TECHNOLOGIES INC·Filed 1999·Granted Nov 14, 2000·21 cites·14 claims
- 1360US5011819AProcess using supercritical conditions for producing highly accurate and homogeneous powder mixture useful in fabrication of high quality ceramic superconductorsHEWLETT PACKARD CO·Filed 1988·Granted Apr 30, 1991·17 cites·11 claims
- 1455US6268656B1Method and structure for uniform height solder bumps on a semiconductor waferAGILENT TECHNOLOGIES INC·Filed 2000·Granted Jul 31, 2001·10 cites·6 claims
- 1550US5268048AReworkable die attachmentHEWLETT PACKARD CO·Filed 1992·Granted Dec 7, 1993·22 cites·2 claims
- 1645US5200300AMethods for forming high density multi-chip carriersHEWLETT PACKARD CO·Filed 1991·Granted Apr 6, 1993·16 cites·15 claims
- 1741US5399528AMulti-layer fabrication in integrated circuit systemsFiled 1993·Granted Mar 21, 1995·9 cites·5 claims
- 1838US5086335ATape automated bonding system which facilitate repairHEWLETT PACKARD CO·Filed 1990·Granted Feb 4, 1992·9 cites·2 claims
- 1929US5749988AReworkable die attachment to heat spreaderFiled 1994·Granted May 12, 1998·7 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →