Inventor · disambiguated record
Mitsuro Hamuro
Also filed as: HAMURO MITSURO
25 granted patents·372 citations·filing 1982–1996
97Inventor score
Top patents by PatentIndex Score
25 records- 0184US5316602AMethod for manufacturing ceramic green sheet laminate for an electronic componentMURATA MANUFACTURING CO·Filed 1991·Granted May 31, 1994·26 cites·8 claims
- 0281US4846345ACassette storing a plurality of electronic component chips including means for securing the cassette to a hopperMURATA MANUFACTURING CO·Filed 1987·Granted Jul 11, 1989·37 cites·12 claims
- 0377US5567240AApparatus for manufacturing ceramic green sheet laminate for an electronic componentMURATA MANUFACTURING CO·Filed 1994·Granted Oct 22, 1996·16 cites·8 claims
- 0473US5168805AScreen printing method and method of producing screen printing platesMURATA MANUFACTURING CO·Filed 1991·Granted Dec 8, 1992·32 cites·5 claims
- 0570US5330574AElectrode forming apparatusMURATA MANUFACTURING CO·Filed 1992·Granted Jul 19, 1994·32 cites·14 claims
- 0663US5177841AMethod of manufacturing ceramic layered productMURATA MANUFACTURING CO·Filed 1991·Granted Jan 12, 1993·24 cites·11 claims
- 0763US4954207AApparatus for automatically taping electronic componentsMURATA MANUFACTURING CO·Filed 1989·Granted Sep 4, 1990·19 cites·17 claims
- 0862US5505809AMethod of preparing a plurality of ceramic green sheets having conductor films thereonMURATA MANUFACTURING CO·Filed 1993·Granted Apr 9, 1996·21 cites·15 claims
- 0959US4633370AChip-like electronic component seriesMURATA MANUFACTURING CO·Filed 1985·Granted Dec 30, 1986·29 cites·16 claims
- 1057US5174842AMethod for laminating ceramic green sheetsMURATA MANUFACTURING CO·Filed 1990·Granted Dec 29, 1992·16 cites·5 claims
- 1152US5540535AApparatus for pushing chip components into holding plateMURATA MANUFACTURING CO·Filed 1994·Granted Jul 30, 1996·14 cites·21 claims
- 1250US5806715AChip alignment/feed apparatusMURATA MANUFACTURING CO·Filed 1996·Granted Sep 15, 1998·15 cites·10 claims
- 1350US4803777AMethod of manufacturing an electric component with a lead wire secured in a through holeNAKAGAWA MASAYUKI·Filed 1985·Granted Feb 14, 1989·8 cites·5 claims
- 1447US5364014AMethod of and apparatus for manufacturing electronic componentMURATA MANUFACTURING CO·Filed 1993·Granted Nov 15, 1994·8 cites·14 claims
- 1547US5224250AApparatus for manufacturing ceramic capacitorsMURATA MANUFACTURING CO·Filed 1992·Granted Jul 6, 1993·10 cites·7 claims
- 1645US5796616AApparatus for automatically replenishing chipsMURATA MANUFACTURING CO·Filed 1996·Granted Aug 18, 1998·12 cites·11 claims
- 1745US5358593AApparatus for laminating ceramic green sheetsMURATA MANUFACTURING CO·Filed 1992·Granted Oct 25, 1994·11 cites·8 claims
- 1842US4823103AElectrical component having a lead wire secured in a through holeMURATA MANUFACTURING CO·Filed 1988·Granted Apr 18, 1989·6 cites·2 claims
- 1939US4453633AElectronic component seriesMURATA MANUFACTURING CO·Filed 1982·Granted Jun 12, 1984·6 cites·4 claims
- 2037US5486377AMethod for manufacturing chip-like electronic partsMURATA MANUFACTURING CO·Filed 1994·Granted Jan 23, 1996·6 cites·6 claims
- 2137US5262729AMethod of measuring characteristics of electronic partsMURATA MANUFACTURING CO·Filed 1992·Granted Nov 16, 1993·7 cites·8 claims
- 2234US5547511AElectrode forming system for chip componentsMURATA MANUFACTURING CO·Filed 1993·Granted Aug 20, 1996·6 cites·26 claims
- 2333US5244073AMethod of pressing chip type electronic componentsMURATA MANUFACTURING CO·Filed 1992·Granted Sep 14, 1993·5 cites·8 claims
- 2433US4990817AChip type electronic partMURATA MANUFACTURING CO·Filed 1986·Granted Feb 5, 1991·3 cites·4 claims
- 2532US5160066AApparatus for aligning electronic component chipsMURATA MANUFACTURING CO·Filed 1991·Granted Nov 3, 1992·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →