Inventor · disambiguated record
Takashi Shinpo
Also filed as: SHINPO TAKASHI
1 granted patent·2 pending applications·3 citations·filing 2006–2018
21Inventor score
Technology areasC08J
Top patents by PatentIndex Score
3 records- 0173US8344262B2Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring boardPANASONIC CORP·Filed 2006·Granted Jan 1, 2013·3 cites·19 claims
- 0248US2021002480A1Resin composition, prepreg, resin-including film, resin-including metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2018·Application pending·0 cites
- 0345US2010096173A1Epoxy resin composition, prepreg, and laminate and printed wiring boardFUJINO KENTARO·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →