Inventor · disambiguated record
Akihiro Shibatomi
Also filed as: SHIBATOMI AKIHIRO
11 granted patents·1 pending application·108 citations·filing 1987–2012
89Inventor score
Top patents by PatentIndex Score
12 records- 0192US8163649B2Copper interconnection structure, semiconductor device, and method for forming copper interconnection structureKOIKE JUNICHI·Filed 2010·Granted Apr 24, 2012·16 cites·8 claims
- 0287US8324730B2Copper interconnection structure and method for forming copper interconnectionsKOIKE JUNICHI·Filed 2009·Granted Dec 4, 2012·11 cites·14 claims
- 0385US4889831AMethod of forming a high temperature stable ohmic contact to a III-V substrateFUJITSU LTD·Filed 1987·Granted Dec 26, 1989·50 cites·9 claims
- 0483US8580688B2Copper interconnection structure and method for forming copper interconnectionsKOIKE JUNICHI·Filed 2011·Granted Nov 12, 2013·5 cites·13 claims
- 0583US8531033B2Contact plug structure, semiconductor device, and method for forming contact plugKOIKE JUNICHI·Filed 2010·Granted Sep 10, 2013·9 cites·30 claims
- 0678US8112885B2Method for forming copper interconnection structuresKOIKE JUNICHI·Filed 2009·Granted Feb 14, 2012·6 cites·21 claims
- 0776US8258626B2Copper interconnection, method for forming copper interconnection structure, and semiconductor deviceKOIKE JUNICHI·Filed 2009·Granted Sep 4, 2012·6 cites·5 claims
- 0874US7755192B2Copper interconnection structure, barrier layer including carbon and hydrogenUNIV TOHOKU·Filed 2009·Granted Jul 13, 2010·5 cites·12 claims
- 0955US8169079B2Copper interconnection structures and semiconductor devicesKOIKE JUNICHI·Filed 2009·Granted May 1, 2012·0 cites·26 claims
- 1051US9082821B2Method for forming copper interconnection structuresKOIKE JUNICHI·Filed 2011·Granted Jul 14, 2015·0 cites·12 claims
- 1149US8420535B2Copper interconnection, method for forming copper interconnection structure, and semiconductor deviceKOIKE JUNICHI·Filed 2012·Granted Apr 16, 2013·0 cites·16 claims
- 1235US2011233560A1Electrode for silicon carbide, silicon carbide semiconductor element, silicon carbide semiconductor device and method for forming electrode for silicon carbideADVANCED INTERCONNECT MATERIALS LLC·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Akihiro Shibatomi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →