Inventor · disambiguated record
Sarah Haney
Also filed as: HANEY SARAH · HANEY SARAH K · HANEY SARAH KAY
19 granted patents·8 pending applications·65 citations·filing 2008–2024
92Inventor score
Files withAVAGO TECHNOLOGIES GENERAL IP7INTEL CORP7AVAGO TECH INT SALES PTE LID6CREE INC3TEH WENG HONG2
Top patents by PatentIndex Score
27 records- 0193US9501068B2Integration of pressure sensors into integrated circuit fabrication and packagingINTEL CORP·Filed 2016·Granted Nov 22, 2016·6 cites·20 claims
- 0292US7795691B2Semiconductor transistor with P type re-grown channel layerCREE INC·Filed 2008·Granted Sep 14, 2010·23 cites·42 claims
- 0391US9260294B2Integration of pressure or inertial sensors into integrated circuit fabrication and packagingLEE KYU OH·Filed 2013·Granted Feb 16, 2016·9 cites·18 claims
- 0486US11723143B1Thermal dissipation and shielding improvement using merged PCB bottom copper postAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Aug 8, 2023·1 cites·20 claims
- 0583US9345184B2Magnetic field shielding for packaging build-up architecturesINTEL CORP·Filed 2013·Granted May 17, 2016·6 cites·22 claims
- 0682US9791470B2Magnet placement for integrated sensor packagesINTEL CORP·Filed 2013·Granted Oct 17, 2017·4 cites·20 claims
- 0780US10827617B2Printed circuit board with cavityAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Nov 3, 2020·3 cites·20 claims
- 0878US8445917B2Bidirectional silicon carbide transient voltage suppression devicesHANEY SARAH KAY·Filed 2009·Granted May 21, 2013·9 cites·20 claims
- 0974US9242854B2Hermetic encapsulation for microelectromechanical systems (MEMS) devicesINTEL CORP·Filed 2013·Granted Jan 26, 2016·2 cites·18 claims
- 1069US12113032B2Substrate having undercut portion for stress mitigationAVAGO TECH INT SALES PTE LID·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 1160US9997428B2Via structures for thermal dissipationAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Granted Jun 12, 2018·1 cites·40 claims
- 1259US9974181B2Module with external shield and back-spill barrier for protecting contact padsAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted May 15, 2018·1 cites·20 claims
- 1359US2025336789A1Posts having multiple widthsAVAGO TECH INT SALES PTE LID·Filed 2024·Application pending·0 cites
- 1458US11276650B2Stress mitigation structureAVAGO TECH INT SALES PTE LID·Filed 2019·Granted Mar 15, 2022·0 cites·20 claims
- 1555US10179729B2Hermetic encapsulation for microelectromechanical systems (MEMS) devicesINTEL CORP·Filed 2016·Granted Jan 15, 2019·0 cites·18 claims
- 1655US2024170384A1Double side molded land grid array package platform using a substrate with copper postsAVAGO TECH INT SALES PTE LID·Filed 2022·Application pending·0 cites
- 1749US10033093B2mmWave antennas and transmission lines on standard substrate materialsINTEL CORP·Filed 2013·Granted Jul 24, 2018·0 cites·8 claims
- 1849US9312256B2Bidirectional silicon carbide transient voltage supression devicesCREE INC·Filed 2013·Granted Apr 12, 2016·0 cites·10 claims
- 1947US2015355035A1In-package temperature sensor and methods thereforINTEL CORP·Filed 2014·Application pending·0 cites
- 2045US2015351229A1Printed circuit board comprising co-planar surface pads and insulating dielectricAVAGO TECHNOLOGIES GENERAL IP·Filed 2014·Application pending·0 cites
- 2144US9505610B2Device, system and method for providing MEMS structures of a semiconductor packageTEH WENG HONG·Filed 2013·Granted Nov 29, 2016·0 cites·19 claims
- 2242US10068834B2Floating bond pad for power semiconductor devicesCREE INC·Filed 2013·Granted Sep 4, 2018·0 cites·22 claims
- 2342US2015217995A1Arrangement of through-hole structures of a semiconductor packageTEH WENG HONG·Filed 2013·Application pending·0 cites
- 2440US10271421B2Systems and methods for providing electromagnetic interference (EMI) shielding between inductors of a radio frequency (RF) moduleAVAGO TECHNOLOGIES GENERAL IP·Filed 2017·Granted Apr 23, 2019·0 cites·17 claims
- 2532US2017215278A1Coreless substrate having primer layers adjacent to bottom and top outer metal layersAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Application pending·0 cites
- 2632US2017018501A1Via structures for thermal dissipationAVAGO TECHNOLOGIES GENERAL IP·Filed 2015·Application pending·0 cites
- 2732US2017223839A1Printed circuit board with compartmental shields for electronic components and methods of fabricating the sameAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →