Inventor · disambiguated record
Soohan Park
Also filed as: PARK SOOHAN
2 granted patents·3 pending applications·3 citations·filing 2007–2023
38Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0159US9257384B2Integrated circuit packaging system with substrate and method of manufacture thereofPARK SOOHAN·Filed 2012·Granted Feb 9, 2016·3 cites·8 claims
- 0259US2023369165A1Heat spreader for use with a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0345US2023402344A1Heat spreader for use with a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0445US2023411263A1Modular semiconductor devices and electronic devices incorporating the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0533US8592989B2Integrated circuit package system with bump over viaNA GUICHEA·Filed 2007·Granted Nov 26, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →