Inventor · disambiguated record
Kun-Jung Wu
Also filed as: WU KUN-JUNG
12 granted patents·4 pending applications·82 citations·filing 1999–2022
88Inventor score
Files withHEWLETT PACKARD DEVELOPMENT CO6POWERCHIP SEMICONDUCTOR CORP4LEXTAR ELECTRONICS CORP2WU KUN-JUNG2CCP CONTACT PROBES CO LTD1
Top patents by PatentIndex Score
16 records- 0173US11166241B2Controlling radio frequency (RF) power output of portable devicesHEWLETT PACKARD DEVELOPMENT CO·Filed 2017·Granted Nov 2, 2021·2 cites·12 claims
- 0270US6234915B1Three-piece golf putterFiled 1999·Granted May 22, 2001·45 cites·1 claims
- 0368US7951668B2Process for fabricating crown capacitors of dram and capacitor structurePOWERCHIP SEMICONDUCTOR CORP·Filed 2009·Granted May 31, 2011·6 cites·18 claims
- 0459US12328174B2Selection of antenna patterns based on image data and depth dataHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Granted Jun 10, 2025·0 cites·15 claims
- 0559US6551877B1Method of manufacturing memory devicePOWERCHIP SEMICONDUCTOR CORP·Filed 2002·Granted Apr 22, 2003·10 cites·16 claims
- 0657US6703855B1Structure of a probeCCP CONTACT PROBES CO LTD·Filed 2002·Granted Mar 9, 2004·12 cites·5 claims
- 0750US6670254B1Method of manufacturing semiconductor device with formation of a heavily doped region by implantation through an insulation layerPOWERCHIP SEMICONDUCTOR CORP·Filed 2002·Granted Dec 30, 2003·3 cites·13 claims
- 0847US2024020374A1Actions based on locations in environmentsHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Application pending·0 cites
- 0944US2023411829A1Antenna assemblies with printed circuit parasitic antenna elementsHEWLETT PACKARD DEVELOPMENT CO·Filed 2022·Application pending·0 cites
- 1043US2023007598A1Transmit power of wireless communicationHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1142US2022320711A1Adjustable slot antennasHEWLETT PACKARD DEVELOPMENT CO·Filed 2019·Application pending·0 cites
- 1240US10475975B2Frame, light-emitting device using the same, and method for manufacturing the sameLEXTAR ELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·12 claims
- 1338US10270020B2LED package structureLEXTAR ELECTRONICS CORP·Filed 2017·Granted Apr 23, 2019·0 cites·10 claims
- 1437US7442561B2Method of piping defect detectionPOWERCHIP SEMICONDUCTOR CORP·Filed 2005·Granted Oct 28, 2008·0 cites·8 claims
- 1532USD653223SLight emitting diode packageWU KUN-JUNG·Filed 2011·Granted Jan 31, 2012·2 cites·1 claims
- 1631USD656108SLight emitting diode lead-frameWU KUN-JUNG·Filed 2011·Granted Mar 20, 2012·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →