Inventor · disambiguated record
Sushrutha Gujjula
Also filed as: GUJJULA SUSHRUTHA · GUJJULA SUSHRUTHA REDDY
6 granted patents·5 pending applications·3 citations·filing 2018–2023
70Inventor score
Top patents by PatentIndex Score
11 records- 0178US12481035B2Silicon photonic systems for LIDAR applicationsINTEL CORP·Filed 2021·Granted Nov 25, 2025·1 cites·25 claims
- 0278US11282717B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2018·Granted Mar 22, 2022·2 cites·12 claims
- 0369US11776821B2Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gapINTEL CORP·Filed 2022·Granted Oct 3, 2023·0 cites·19 claims
- 0462US11830863B2Dual-sided co-packaged optics for high bandwidth networking applicationsINTEL CORP·Filed 2021·Granted Nov 28, 2023·0 cites·19 claims
- 0561US11217573B2Dual-sided co-packaged optics for high bandwidth networking applicationsINTEL CORP·Filed 2020·Granted Jan 4, 2022·0 cites·25 claims
- 0657US12366713B2Heat dissipation structures for optical communication devicesINTEL CORP·Filed 2021·Granted Jul 22, 2025·0 cites·25 claims
- 0756US2023318247A1Package with multiple photonic integrated circuit dies optically coupled with each otherINTEL CORP·Filed 2022·Application pending·0 cites
- 0855US2025110301A1Technologies for thermal plugs in a photonic integrated circuit dieINTEL CORP·Filed 2023·Application pending·0 cites
- 0948US2022413236A1Photonic integrated circuit cooling with a thermal dieINTEL CORP·Filed 2021·Application pending·0 cites
- 1047US2022390562A1Electrical and photonic integrated circuits architectureBAI GUIYUN·Filed 2021·Application pending·0 cites
- 1145US2021210478A1Packaging solutions for high bandwidth networking applicationsINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →