Inventor · disambiguated record
Norihiro Togasaki
Also filed as: TOGASAKI NORIHIRO
1 granted patent·2 pending applications·3 citations·filing 2010–2012
22Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0168US8294282B2Semiconductor device and adhesive sheetHAYASHI HIDEKAZU·Filed 2010·Granted Oct 23, 2012·3 cites·8 claims
- 0233US2010311224A1Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 0332US2012193784A1Method for joining bonding wire, semiconductor device, and method for manufacturing semiconductor deviceTOGASAKI NORIHIRO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →