Inventor · disambiguated record
Jen-Chuan Hsiao
Also filed as: HSIAO JEN-CHUAN
1 granted patent·1 pending application·0 citations·filing 2020–2023
13Inventor score
Technology areasH01F
Files withCYNTEC CO LTD2
Top patents by PatentIndex Score
2 records- 0174US2023335327A1Magnetic component structure with thermal conductive filler and method of fabricating the sameCYNTEC CO LTD·Filed 2023·Application pending·0 cites
- 0265US11710595B2Magnetic component structure with thermal conductive filler and method of fabricating the sameCYNTEC CO LTD·Filed 2020·Granted Jul 25, 2023·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →