Inventor · disambiguated record
Scott Bushman
Also filed as: BUSHMAN SCOTT · BUSHMAN SCOTT G · BUSHMAN SCOTT GREGORY
8 granted patents·3 pending applications·171 citations·filing 1999–2007
87Inventor score
Top patents by PatentIndex Score
11 records- 0193US6535783B1Method and apparatus for the integration of sensor data from a process tool in an advanced process control (APC) frameworkADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 18, 2003·89 cites·22 claims
- 0287US7324865B1Run-to-run control method for automated control of metal deposition processesADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 29, 2008·28 cites·49 claims
- 0381US7700467B2Methodology of implementing ultra high temperature (UHT) anneal in fabricating devices that contain sigeTEXAS INSTRUMENTS INC·Filed 2007·Granted Apr 20, 2010·8 cites·22 claims
- 0466US6546306B1Method for adjusting incoming film thickness uniformity such that variations across the film after polishing minimizedADVANCED MICRO DEVICES INC·Filed 1999·Granted Apr 8, 2003·25 cites·22 claims
- 0564US6850322B2Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnaceADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 1, 2005·9 cites·18 claims
- 0657US6734088B1Control of two-step gate etch processADVANCED MICRO DEVICES INC·Filed 2000·Granted May 11, 2004·8 cites·11 claims
- 0748US6709797B1Method and apparatus for controlling focus based on a thickness of a layer of photoresistADVANCED MICRO DEVICES INC·Filed 2001·Granted Mar 23, 2004·3 cites·11 claims
- 0847US6417912B1Method and apparatus for controlling optical-parameters in a stepperADVANCED MICRO DEVICES INC·Filed 2001·Granted Jul 9, 2002·1 cites·4 claims
- 0942US2006186406A1Method and system for qualifying a semiconductor etch processTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 1037US2009020791A1Process method to fabricate cmos circuits with dual stress contact etch-stop liner layersYU SHAOFENG·Filed 2007·Application pending·0 cites
- 1135US2002192944A1Method and apparatus for controlling a thickness of a copper filmFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →