Inventor · disambiguated record
Ryoya Terakawa
Also filed as: TERAKAWA RYOYA
7 granted patents·3 pending applications·2 citations·filing 2010–2023
69Inventor score
Top patents by PatentIndex Score
10 records- 0169US10710209B2Wafer polishing apparatus and polishing head used for sameSUMCO CORP·Filed 2016·Granted Jul 14, 2020·2 cites·6 claims
- 0269US2024198479A1Polishing head, polishing device and method of manufacturing semiconductor waferSUMCO CORP·Filed 2023·Application pending·0 cites
- 0355US10744616B2Wafer polishing method and apparatusSUMCO CORP·Filed 2016·Granted Aug 18, 2020·0 cites·10 claims
- 0453US11554458B2Polishing head, wafer polishing apparatus using the same, and wafer polishing method using the sameSUMCO CORP·Filed 2019·Granted Jan 17, 2023·0 cites·16 claims
- 0551US12496678B2Method of polishing silicon wafer and method of producing silicon waferSUMCO CORP·Filed 2021·Granted Dec 16, 2025·0 cites·6 claims
- 0650US12285840B2Polishing head, polishing apparatus, and method of manufacturing semiconductor waferSUMCO CORP·Filed 2019·Granted Apr 29, 2025·0 cites·13 claims
- 0750US2024278381A1Polishing head, polishing device, and method of manufacturing semiconductor waferSUMCO CORP·Filed 2022·Application pending·0 cites
- 0844US12179308B2Method of transferring semiconductor wafer to polishing apparatus and method of producing semiconductor waferSUMCO CORP·Filed 2020·Granted Dec 31, 2024·0 cites·18 claims
- 0933US2020258735A1Wafer polishing method and apparatusSUMCO CORP·Filed 2016·Application pending·0 cites
- 1032US8784159B2Method for polishing semiconductor waferTERAKAWA RYOYA·Filed 2010·Granted Jul 22, 2014·0 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →