Inventor · disambiguated record
Shriram Paranjpe
Also filed as: PARANJPE SHRIRAM
3 granted patents·2 pending applications·1 citations·filing 2013–2017
46Inventor score
Files withMCCORMICK & CO INC5
Top patents by PatentIndex Score
5 records- 0158US10897918B1Extrusion encapsulation with narrow particle size and shape distribution, high solubility, and low surface oilMCCORMICK & CO INC·Filed 2014·Granted Jan 26, 2021·1 cites·29 claims
- 0255US2014272011A1Encapsulation compositions comprising of spices, herbs, fruit, and vegetable powdersMCCORMICK & CO INC·Filed 2014·Application pending·0 cites
- 0352US9687010B2Extrusion encapsulation of actives at an increased load, using surface active plant extractsMCCORMICK & CO INC·Filed 2013·Granted Jun 27, 2017·0 cites·41 claims
- 0451US2019307156A1Natural encapsulation flavor productsMCCORMICK & CO INC·Filed 2017·Application pending·0 cites
- 0542US11026446B2High integrity encapsulation productMCCORMICK & CO INC·Filed 2016·Granted Jun 8, 2021·0 cites·37 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →