Inventor · disambiguated record
Kay Stefan Essig
Also filed as: ESSIG KAY · ESSIG KAY STEFAN
16 granted patents·5 pending applications·41 citations·filing 2010–2023
90Inventor score
Top patents by PatentIndex Score
21 records- 0197US11682656B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 20, 2023·4 cites·18 claims
- 0294US10186467B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 22, 2019·10 cites·20 claims
- 0393US11791245B2Electronic package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 17, 2023·2 cites·18 claims
- 0493US10217728B2Semiconductor package and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 26, 2019·11 cites·47 claims
- 0586US9991193B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 5, 2018·4 cites·20 claims
- 0684US12009317B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 11, 2024·1 cites·9 claims
- 0781US11545406B2Substrate structure, semiconductor package structure and method for manufacturing a substrate structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 3, 2023·1 cites·8 claims
- 0881US10005660B1Semiconductor package device including microelectromechanical systemADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 26, 2018·2 cites·18 claims
- 0979US11145624B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 12, 2021·2 cites·21 claims
- 1078US10978312B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 13, 2021·2 cites·45 claims
- 1177US11437247B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 6, 2022·1 cites·18 claims
- 1268US11574856B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 1360US8309400B2Leadframe package structure and manufacturing method thereofAPPELT BERND KARL·Filed 2010·Granted Nov 13, 2012·1 cites·21 claims
- 1458US11705401B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jul 18, 2023·0 cites·14 claims
- 1558US2025029951A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1656US2024355793A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1755US11881448B2Semiconductor package structure having substrate with embedded electronic component and conductive pillarsADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 23, 2024·0 cites·17 claims
- 1852US10777478B2Semiconductor package device for power deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Sep 15, 2020·0 cites·21 claims
- 1952US2019088506A1Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 2051US2019363039A1Semiconductor package and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 2145US2016218021A1Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →