Inventor · disambiguated record
Fernando A. Santos
Also filed as: SANTOS FERNANDO A
31 granted patents·5 pending applications·104 citations·filing 2011–2023
96Inventor score
Files withNXP USA INC21FREESCALE SEMICONDUCTOR INC7VISWANATHAN LAKSHMINARAYAN3SANCHEZ AUDEL A2SANTOS FERNANDO A2
Top patents by PatentIndex Score
36 records- 0197US10199302B1Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2017·Granted Feb 5, 2019·15 cites·13 claims
- 0297US10199303B1Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2017·Granted Feb 5, 2019·14 cites·18 claims
- 0395US9450547B2Semiconductor package having an isolation wall to reduce electromagnetic couplingFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Sep 20, 2016·18 cites·33 claims
- 0494US11581241B2Circuit modules with front-side interposer terminals and through-module thermal dissipation structuresNXP USA INC·Filed 2020·Granted Feb 14, 2023·3 cites·19 claims
- 0594US11342275B2Leadless power amplifier packages including topside terminations and methods for the fabrication thereofNXP USA INC·Filed 2020·Granted May 24, 2022·4 cites·10 claims
- 0692US9986646B2Packaged electronic devices with top terminations, and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 29, 2018·11 cites·10 claims
- 0790US11984429B2Leadless power amplifier packages including topside termination interposer arrangements and methods for the fabrication thereofNXP USA INC·Filed 2021·Granted May 14, 2024·2 cites·20 claims
- 0889US8803302B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Aug 12, 2014·9 cites·19 claims
- 0987US8698291B2Packaged leadless semiconductor deviceSANCHEZ AUDEL A·Filed 2011·Granted Apr 15, 2014·10 cites·20 claims
- 1085US12040291B2Radio frequency packages containing multilevel power substrates and associated fabrication methodsNXP USA INC·Filed 2021·Granted Jul 16, 2024·1 cites·20 claims
- 1182US12184237B2Surface-mount amplifier devicesNXP USA INC·Filed 2021·Granted Dec 31, 2024·1 cites·20 claims
- 1281US11343919B2Packaged electronic devices with top terminationsNXP USA INC·Filed 2019·Granted May 24, 2022·2 cites·11 claims
- 1380US10375833B2Methods of manufacturing packaged electronic devices with top terminationsNXP USA INC·Filed 2018·Granted Aug 6, 2019·2 cites·22 claims
- 1479US10741446B2Method of wafer dicing for wafers with backside metallization and packaged diesNXP USA INC·Filed 2017·Granted Aug 11, 2020·2 cites·20 claims
- 1576US10529638B2Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2018·Granted Jan 7, 2020·1 cites·20 claims
- 1676US10396006B2Molded air cavity packages and methods for the production thereofNXP USA INC·Filed 2018·Granted Aug 27, 2019·1 cites·20 claims
- 1776US9300254B2Radio frequency devices with surface-mountable capacitors for decoupling and methods thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Mar 29, 2016·3 cites·17 claims
- 1871US10110170B2Semiconductor package having an isolation wall to reduce electromagnetic couplingFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 23, 2018·1 cites·14 claims
- 1967US9337774B2Packaged RF amplifier devices and methods of manufacture thereofFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted May 10, 2016·3 cites·20 claims
- 2064US11621231B2Methods of fabricating leadless power amplifier packages including topside terminationsNXP USA INC·Filed 2022·Granted Apr 4, 2023·0 cites·19 claims
- 2162US11437276B2Packaged dies with metal outer layers extending from die back sides toward die front sidesNXP USA INC·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 2260US10630243B2Semiconductor package having an isolation wall to reduce electromagnetic couplingNXP USA INC·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 2360US10476442B2Semiconductor package having an isolation wall to reduce electromagnetic couplingNXP USA INC·Filed 2018·Granted Nov 12, 2019·0 cites·14 claims
- 2458US12446158B2Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modulesNXP USA INC·Filed 2023·Granted Oct 14, 2025·0 cites·16 claims
- 2557US2025167185A1Stacked electronic packagesNXP USA INC·Filed 2023·Application pending·0 cites
- 2657US2025167083A1Panel level fabrication of stacked electronic device packages with enclosed cavitiesNXP USA INC·Filed 2023·Application pending·0 cites
- 2756US9263375B2System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Feb 16, 2016·0 cites·14 claims
- 2855US2024203912A1Amplifier modules and systems with ground terminals adjacent to power amplifier dieNXP USA INC·Filed 2022·Application pending·0 cites
- 2954US8890339B1Self-defining, low capacitance wire bond padSANTOS FERNANDO A·Filed 2013·Granted Nov 18, 2014·1 cites·15 claims
- 3053US8963305B2Method and apparatus for multi-chip structure semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2012·Granted Feb 24, 2015·0 cites·20 claims
- 3151US9800208B2Radio frequency devices with surface-mountable capacitors for decoupling and methods thereofFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Oct 24, 2017·0 cites·18 claims
- 3250US9159588B2Packaged leadless semiconductor deviceSANCHEZ AUDEL A·Filed 2014·Granted Oct 13, 2015·0 cites·20 claims
- 3349US2016163623A1System, method and apparatus for leadless surface mounted semiconductor packageVISWANATHAN LAKSHMINARAYAN·Filed 2016·Application pending·0 cites
- 3446US9236363B2Wedge bond foot jumper connectionsJONES JEFFREY K·Filed 2014·Granted Jan 12, 2016·0 cites·17 claims
- 3544US9466588B2Method and apparatus for multi-chip structure semiconductor packageSANTOS FERNANDO A·Filed 2015·Granted Oct 11, 2016·0 cites·17 claims
- 3639US2020098684A1Transistor, packaged device, and method of fabricationNXP USA INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →