Inventor · disambiguated record
Sheng Huang Jao
Also filed as: JAO SHENG HUANG
2 granted patents·91 citations·filing 2010–2011
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0193US7932608B2Through-silicon via formed with a post passivation interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Apr 26, 2011·52 cites·20 claims
- 0290US8390125B2Through-silicon via formed with a post passivation interconnect structureTSENG MING-HONG·Filed 2011·Granted Mar 5, 2013·39 cites·11 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →