Inventor · disambiguated record
Hyeon Kim
Also filed as: KIM HYEON · KIM HYEON NAM
1 granted patent·1 pending application·0 citations·filing 2015–2021
1Inventor score
Top patents by PatentIndex Score
2 records- 0153US2024222005A1Method of encapsulating magnetic core using low-pressure insert injection molding and magnetic core encapsulated by the sameCHANG SUNG CO·Filed 2021·Application pending·0 cites
- 0231US11046007B2Apparatus and method for calibrating optimum size of 3D printingGM GLOBAL TECH OPERATIONS LLC·Filed 2015·Granted Jun 29, 2021·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Hyeon Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →