Inventor · disambiguated record
Yezdi Dordi
Also filed as: BIRKMAIER GEORGE · DORDI YEZDI · DORDI YEZDI N · DORDI YEZDI NAVAL
107 granted patents·42 pending applications·3,724 citations·filing 1994–2021
99Inventor score
Top patents by PatentIndex Score
149 records- 0198US6258220B1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·443 cites·26 claims
- 0298US6258223B1In-situ electroless copper seed layer enhancement in an electroplating systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 10, 2001·399 cites·9 claims
- 0398US5835355ATape ball grid array package with perforated metal stiffenerLSI LOGIC CORP·Filed 1997·Granted Nov 10, 1998·345 cites·20 claims
- 0498US5604376APaddleless molded plastic semiconductor chip packageDIGITAL EQUIPMENT CORP·Filed 1994·Granted Feb 18, 1997·338 cites·11 claims
- 0597US6645550B1Method of treating a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Nov 11, 2003·249 cites·17 claims
- 0697US6416647B1Electro-chemical deposition cell for face-up processing of single semiconductor substratesAPPLIED MATERIALS INC·Filed 1999·Granted Jul 9, 2002·476 cites·25 claims
- 0796US6436267B1Method for achieving copper fill of high aspect ratio interconnect featuresAPPLIED MATERIALS INC·Filed 2000·Granted Aug 20, 2002·105 cites·35 claims
- 0895US10163695B1Self-forming barrier processLAM RES CORP·Filed 2017·Granted Dec 25, 2018·7 cites·23 claims
- 0994US7615480B2Methods of post-contact back end of the line through-hole via integrationLAM RES CORP·Filed 2007·Granted Nov 10, 2009·22 cites·17 claims
- 1094US6582578B1Method and associated apparatus for tilting a substrate upon entry for metal depositionAPPLIED MATERIALS INC·Filed 2000·Granted Jun 24, 2003·80 cites·28 claims
- 1194US6267853B1Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 1999·Granted Jul 31, 2001·211 cites·10 claims
- 1293US10262943B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2018·Granted Apr 16, 2019·7 cites·19 claims
- 1393US9583386B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2015·Granted Feb 28, 2017·8 cites·21 claims
- 1493US6881318B2Dynamic pulse plating for high aspect ratio featuresAPPLIED MATERIALS INC·Filed 2001·Granted Apr 19, 2005·38 cites·21 claims
- 1592US9469902B2Electroless deposition of continuous platinum layerLAM RES CORP·Filed 2014·Granted Oct 18, 2016·13 cites·26 claims
- 1692US7829152B2Electroless plating method and apparatusLAM RES CORP·Filed 2006·Granted Nov 9, 2010·18 cites·8 claims
- 1792US7297190B1Plating solutions for electroless deposition of copperLAM RES CORP·Filed 2006·Granted Nov 20, 2007·36 cites·25 claims
- 1891US8241701B2Processes and systems for engineering a barrier surface for copper depositionDORDI YEZDI·Filed 2006·Granted Aug 14, 2012·16 cites·28 claims
- 1991US6635157B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2001·Granted Oct 21, 2003·43 cites·68 claims
- 2091US6613214B2Electric contact element for electrochemical deposition system and methodAPPLIED MATERIALS INC·Filed 2000·Granted Sep 2, 2003·56 cites·38 claims
- 2191US6521102B1Perforated anode for uniform deposition of a metal layerAPPLIED MATERIALS INC·Filed 2000·Granted Feb 18, 2003·53 cites·20 claims
- 2290US8883027B2Methods for removing a metal oxide from a substrateYOON HYUNGSUK ALEXANDER·Filed 2010·Granted Nov 11, 2014·10 cites·30 claims
- 2390US8771804B2Processes and systems for engineering a copper surface for selective metal depositionDORDI YEZDI·Filed 2006·Granted Jul 8, 2014·16 cites·27 claims
- 2490US8622020B2Simultaneous electroless plating of two substratesTHIE WILLIAM·Filed 2010·Granted Jan 7, 2014·10 cites·17 claims
- 2590US8287647B2Apparatus and method for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2007·Granted Oct 16, 2012·12 cites·7 claims
- 2690US5859474AReflow ball grid array assemblyLSI LOGIC CORP·Filed 1997·Granted Jan 12, 1999·108 cites·163 claims
- 2789US10483163B2Self-forming barrier processLAM RES CORP·Filed 2018·Granted Nov 19, 2019·2 cites·21 claims
- 2889US7153400B2Apparatus and method for depositing and planarizing thin films of semiconductor wafersLAM RES CORP·Filed 2003·Granted Dec 26, 2006·33 cites·12 claims
- 2989US6494219B1Apparatus with etchant mixing assembly for removal of unwanted electroplating depositsAPPLIED MATERIALS INC·Filed 2000·Granted Dec 17, 2002·47 cites·19 claims
- 3088US6585876B2Flow diffuser to be used in electro-chemical plating system and methodAPPLIED MATERIALS INC·Filed 2000·Granted Jul 1, 2003·35 cites·38 claims
- 3188US6254760B1Electro-chemical deposition system and methodAPPLIED MATERIALS INC·Filed 1999·Granted Jul 3, 2001·101 cites·14 claims
- 3287US7497932B2Electro-chemical deposition systemAPPLIED MATERIALS INC·Filed 2006·Granted Mar 3, 2009·9 cites·4 claims
- 3386US8916232B2Method for barrier interface preparation of copper interconnectYOON HYUNGSUK ALEXANDER·Filed 2006·Granted Dec 23, 2014·9 cites·30 claims
- 3486US6837978B1Deposition uniformity control for electroplating apparatus, and associated methodAPPLIED MATERIALS INC·Filed 2000·Granted Jan 4, 2005·36 cites·30 claims
- 3586US6423636B1Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor waferAPPLIED MATERIALS INC·Filed 1999·Granted Jul 23, 2002·47 cites·16 claims
- 3685US8026605B2Interconnect structure and method of manufacturing a damascene structureLAM RES CORP·Filed 2006·Granted Sep 27, 2011·8 cites·18 claims
- 3785US7521358B2Process integration scheme to lower overall dielectric constant in BEoL interconnect structuresLAM RES CORP·Filed 2007·Granted Apr 21, 2009·11 cites·25 claims
- 3884US7662253B2Apparatus for the removal of a metal oxide from a substrate and methods thereforLAM RES CORP·Filed 2005·Granted Feb 16, 2010·8 cites·20 claims
- 3984US6551484B2Reverse voltage bias for electro-chemical plating system and methodAPPLIED MATERIALS INC·Filed 2001·Granted Apr 22, 2003·29 cites·30 claims
- 4083US10501846B2Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatmentLAM RES CORP·Filed 2017·Granted Dec 10, 2019·4 cites·11 claims
- 4183US8747960B2Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicideDORDI YEZDI·Filed 2006·Granted Jun 10, 2014·11 cites·20 claims
- 4283US8519461B2Device with post-contact back end of line through-hole via integrationBOYD JOHN·Filed 2012·Granted Aug 27, 2013·4 cites·5 claims
- 4383US7615486B2Apparatus and method for integrated surface treatment and deposition for copper interconnectLAM RES CORP·Filed 2007·Granted Nov 10, 2009·7 cites·22 claims
- 4481US9875968B2Interlevel conductor pre-fill utilizing selective barrier depositionLAM RES CORP·Filed 2017·Granted Jan 23, 2018·2 cites·19 claims
- 4581US7427338B2Flow diffuser to be used in electro-chemical plating systemAPPLIED MATERIALS INC·Filed 2003·Granted Sep 23, 2008·21 cites·2 claims
- 4680US7947157B2Apparatus and method for depositing and planarizing thin films of semiconductor wafersLAM RES CORP·Filed 2006·Granted May 24, 2011·5 cites·15 claims
- 4778US8298325B2Electroless deposition from non-aqueous solutionsNORKUS EUGENIJUS·Filed 2010·Granted Oct 30, 2012·3 cites·17 claims
- 4878US7090562B1Methods of and apparatus for pre-planarizing a substrateLAM RES CORP·Filed 2005·Granted Aug 15, 2006·7 cites·11 claims
- 4977US7862693B2Apparatus for plating semiconductor wafersLAM RES CORP·Filed 2009·Granted Jan 4, 2011·4 cites·14 claims
- 5077US7752996B2Apparatus for applying a plating solution for electroless depositionLAM RES CORP·Filed 2006·Granted Jul 13, 2010·4 cites·9 claims
Showing the top 50 of 149 patent records by PatentIndex Score.
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