Inventor · disambiguated record
Yun-Yeu Yeh
Also filed as: YEH YUN-YEU
6 granted patents·8 pending applications·77 citations·filing 2003–2016
83Inventor score
Top patents by PatentIndex Score
14 records- 0178US7180740B2Method and apparatus for side-type heat dissipationDATECH TECHNOLOGY CO LTD·Filed 2004·Granted Feb 20, 2007·32 cites·7 claims
- 0277USD513799SFan housingDATECH TECHNOLOGY CO LTD·Filed 2004·Granted Jan 24, 2006·22 cites·1 claims
- 0357US7192254B2Radial fan having axial fan blade configurationDATECH TECHNOLOGY CO LTD·Filed 2004·Granted Mar 20, 2007·11 cites·5 claims
- 0450US9593887B2Heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layersTAI-SOL ELECTRONICS CO LTD·Filed 2015·Granted Mar 14, 2017·1 cites·6 claims
- 0544USD512499SHeat dissipating fanDATECH TECHNOLOGY CO LTD·Filed 2003·Granted Dec 6, 2005·7 cites·1 claims
- 0641USD530809SFan hubDATECH TECHNOLOGY CO LTD·Filed 2004·Granted Oct 24, 2006·4 cites·1 claims
- 0740US2017363367A1Heat dissipation deviceTAI-SOL ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 0838US2005254957A1Fan hub with a rocket shaped endDATECH TECHNOLOGY CO LTD·Filed 2004·Application pending·0 cites
- 0933US2016262289A1Heat spreader-based heat sink moduleTAI-SOL ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1033US2006102325A1Guiding fin heat sinkDETECH TECHNOLOGY CO LTD·Filed 2004·Application pending·0 cites
- 1132US2017034952A1Fixture device for heat-dissipating module and heat-dissipating module having fixture deviceTAI-SOL ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1231US2017350657A1Heat spreader with a liquid-vapor separation structureTAI-SOL ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
- 1331US2016209121A1Heat-dissipating structureTAI SOL ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 1429US2016219755A1Thermoelectric-cooling-chip-based heat-disspating systemTAI-SOL ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →