Inventor · disambiguated record
Hirokazu Kurisu
Also filed as: KURISU HIROKAZU
5 granted patents·4 pending applications·161 citations·filing 2000–2012
84Inventor score
Top patents by PatentIndex Score
9 records- 0194US6376332B1Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing methodCANON KK·Filed 2000·Granted Apr 23, 2002·93 cites·56 claims
- 0277US6653206B2Method and apparatus for processing composite memberCANON KK·Filed 2001·Granted Nov 25, 2003·21 cites·54 claims
- 0376US6900114B2Separating apparatus, separating method, and method of manufacturing semiconductor substrateCANON KK·Filed 2003·Granted May 31, 2005·20 cites·2 claims
- 0474US6979629B2Method and apparatus for processing composite memberCANON KK·Filed 2003·Granted Dec 27, 2005·18 cites·11 claims
- 0562US6609446B1Separating apparatus, separating method, and method of manufacturing semiconductor substrateCANON KK·Filed 2000·Granted Aug 26, 2003·9 cites·17 claims
- 0645US2013189835A1Method for cleaning a semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 0741US2010330794A1Method for cleaning a semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 0838US2002081822A1Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing methodFiled 2002·Application pending·0 cites
- 0934US2010178764A1Method for fabricating semiconductor deviceNARITA KENJI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →