Inventor · disambiguated record

Sam Il Kim

Also filed as: KIM SAM IL

1 granted patent·279 citations·filing 1997–1997

57Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

1 record

0192US6004867AChip-size packages assembled using mass production techniques at the wafer-levelSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Dec 21, 1999·279 cites·15 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →