Inventor · disambiguated record
Eul Chul Jang
Also filed as: JANG EUL-CHUL
3 granted patents·1 pending application·20 citations·filing 2004–2013
65Inventor score
Top patents by PatentIndex Score
4 records- 0187US7808072B2Circuit board having conductive shield member and semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Oct 5, 2010·16 cites·7 claims
- 0271US8084839B2Circuit board having conductive shield member and semiconductor package using the sameCHOI BOK KYU·Filed 2010·Granted Dec 27, 2011·3 cites·6 claims
- 0359US9609742B2Electrical characteristics of package substrates and semiconductor packages including the sameSK HYNIX INC·Filed 2013·Granted Mar 28, 2017·1 cites·8 claims
- 0435US2006027901A1Stacked chip package with exposed lead-frame bottom surfaceTSAI MING-SUNG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →