Inventor · disambiguated record
Toshihiko Taguchi
Also filed as: TAGUCHI TOSHIHIKO
18 granted patents·3 pending applications·464 citations·filing 1974–2019
96Inventor score
Files withSENJU METAL INDUSTRY CO13MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5NIPPON DENSO CO1OHNISHI TSUKASA1
Top patents by PatentIndex Score
21 records- 0189US4097266AMicrosphere of solder having a metallic core and production thereofSENJU METAL INDUSTRY CO·Filed 1975·Granted Jun 27, 1978·88 cites·16 claims
- 0288US6402013B2Thermosetting soldering flux and soldering processSENJU METAL INDUSTRY CO·Filed 2000·Granted Jun 11, 2002·46 cites·20 claims
- 0384US6241942B1Lead-free solder alloysMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jun 5, 2001·51 cites·28 claims
- 0481US3963162AMethod of soldering stainless steel pipes by using soft soldersSENJU METAL INDUSTRY CO·Filed 1974·Granted Jun 15, 1976·29 cites·7 claims
- 0580US6503338B1Lead-free solder alloysSENJU METAL INDUSTRY CO·Filed 2000·Granted Jan 7, 2003·21 cites·35 claims
- 0679US6896172B2Lead-free solder paste for reflow solderingSENJU METAL INDUSTRY CO·Filed 2004·Granted May 24, 2005·26 cites·17 claims
- 0776US6488888B2Lead-free solder alloysMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 3, 2002·18 cites·7 claims
- 0876US6440228B1Lead-free zinc-containing solder pasteSENJU METAL INDUSTRY CO·Filed 2001·Granted Aug 27, 2002·19 cites·7 claims
- 0976US4988395AWater-soluble soldering flux and paste solder using the fluxSENJU METAL INDUSTRY CO·Filed 1990·Granted Jan 29, 1991·37 cites·17 claims
- 1069US5176759APaste solder with minimized residueSENJU METAL INDUSTRY CO·Filed 1991·Granted Jan 5, 1993·39 cites·14 claims
- 1168US6926849B2Solder pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 9, 2005·14 cites·12 claims
- 1267US6159304ASolder pasteMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Dec 12, 2000·26 cites·2 claims
- 1365US6050480ASolder paste for chip componentsSENJU METAL INDUSTRY CO·Filed 1997·Granted Apr 18, 2000·18 cites·7 claims
- 1464US8220692B2Lead-free solderOHNISHI TSUKASA·Filed 2009·Granted Jul 17, 2012·2 cites·5 claims
- 1559US7282174B2Lead-free solder and soldered articleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 16, 2007·7 cites·14 claims
- 1657US6736907B2Solder pasteSENJU METAL INDUSTRY CO·Filed 2002·Granted May 18, 2004·6 cites·7 claims
- 1754US7681777B2Solder paste and printed circuit boardSENJU METAL INDUSTRY CO·Filed 2004·Granted Mar 23, 2010·7 cites·19 claims
- 1849US2020384577A1Soldering alloy and solder jointSENJU METAL INDUSTRY CO·Filed 2019·Application pending·0 cites
- 1941US5074928AWater-soluble soldering fluxNIPPON DENSO CO·Filed 1990·Granted Dec 24, 1991·10 cites·10 claims
- 2039US2003021719A1Lead-free solder alloysSENJU METAL INDUSTRY CO·Filed 2002·Application pending·0 cites
- 2136US2001019075A1Thermosetting soldering flux and soldering processFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →