Inventor · disambiguated record
Curt Dundas
Also filed as: DUNDAS CURT · DUNDAS CURT T
13 granted patents·7 pending applications·397 citations·filing 1999–2005
94Inventor score
Top patents by PatentIndex Score
20 records- 0193US6632292B1Selective treatment of microelectronic workpiece surfacesSEMITOOL INC·Filed 2000·Granted Oct 14, 2003·62 cites·24 claims
- 0291US6423642B1Reactor for processing a semiconductor waferSEMITOOL INC·Filed 1999·Granted Jul 23, 2002·78 cites·38 claims
- 0390US6508920B1Apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic deviceSEMITOOL INC·Filed 1999·Granted Jan 21, 2003·88 cites·53 claims
- 0485US7429537B2Methods and apparatus for rinsing and dryingSEMITOOL INC·Filed 2005·Granted Sep 30, 2008·11 cites·15 claims
- 0585US7399713B2Selective treatment of microelectric workpiece surfacesSEMITOOL INC·Filed 2003·Granted Jul 15, 2008·26 cites·42 claims
- 0685US6413436B1Selective treatment of the surface of a microelectronic workpieceSEMITOOL INC·Filed 1999·Granted Jul 2, 2002·61 cites·17 claims
- 0778US7102763B2Methods and apparatus for processing microelectronic workpieces using metrologySEMITOOL INC·Filed 2001·Granted Sep 5, 2006·22 cites·69 claims
- 0877US6794291B2Reactor for processing a semiconductor waferSEMITOOL INC·Filed 2002·Granted Sep 21, 2004·13 cites·26 claims
- 0975US6692613B2Reactor for processing a semiconductor waferSEMITOOL INC·Filed 2002·Granted Feb 17, 2004·11 cites·11 claims
- 1073US6447633B1Reactor for processing a semiconductor waferSEMITOOL INC·Filed 2000·Granted Sep 10, 2002·10 cites·39 claims
- 1159US7462269B2Method for low temperature annealing of metallization micro-structures in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Granted Dec 9, 2008·5 cites·33 claims
- 1253US6994776B2Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic deviceSEMITOOL INC·Filed 2001·Granted Feb 7, 2006·5 cites·6 claims
- 1347US2005233589A1Processes for removing residue from a workpieceAEGERTER BRIAN K·Filed 2005·Application pending·0 cites
- 1447US2005217707A1Selective processing of microelectronic workpiece surfacesAEGERTER BRIAN K·Filed 2005·Application pending·0 cites
- 1545US2005032391A1Method for processing a semiconductor waferSEMITOOL INC·Filed 2004·Application pending·0 cites
- 1641US2002144973A1Selective treatment of the surface of a microelectronic workpieceSEMITOOL INC·Filed 2002·Application pending·0 cites
- 1741US2002168863A1Selective treatment of the surface of a microelectronic workpieceSEMITOOL INC·Filed 2002·Application pending·0 cites
- 1841US2004035448A1Selective treatment of microelectronic workpiece surfacesFiled 2003·Application pending·0 cites
- 1939US7001471B2Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic deviceSEMITOOL INC·Filed 1999·Granted Feb 21, 2006·5 cites·102 claims
- 2039US2005020001A1Selective treatment of the surface of a microelectronic workpieceFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →