Inventor · disambiguated record
Takenori Suzuki
Also filed as: SUZUKI TAKENORI
17 granted patents·6 pending applications·250 citations·filing 1976–2017
93Inventor score
Files withTOYO ROKI SEIZO KK6KINOUCHI MASATO4MITSUBISHI HEAVY IND MACHINE TOOL CO LTD4TSUNO TAKESHI3FUJITSU LTD1
Top patents by PatentIndex Score
23 records- 0190US5538542AFuel vapor capturing canister having increased distance of flow of fuel vapor passing through adsorbent layerTOYO ROKI SEIZO KK·Filed 1994·Granted Jul 23, 1996·60 cites·8 claims
- 0288US5538543AFuel vapor capturing canister having increased distance of flow of fuel vapor passing through adsorbent layerTOYO ROKI SEIZO KK·Filed 1994·Granted Jul 23, 1996·72 cites·3 claims
- 0382US6514326B1Canister moduleTOYO ROKI SEIZO KK·Filed 2000·Granted Feb 4, 2003·23 cites·17 claims
- 0478US9443711B2Room-temperature bonding apparatusKINOUCHI MASATO·Filed 2012·Granted Sep 13, 2016·5 cites·6 claims
- 0576US9130000B2Wafer bonding device and wafer bonding methodTSUNO TAKESHI·Filed 2009·Granted Sep 8, 2015·6 cites·8 claims
- 0672US5645036AFuel vapor capturing canister having increased distance of flow of fuel vapor passing through adsorbent layerHONDA MOTOR CO LTD·Filed 1995·Granted Jul 8, 1997·30 cites·5 claims
- 0770US5304235ACanisterTOYO ROKI SEIZO KK·Filed 1992·Granted Apr 19, 1994·34 cites·10 claims
- 0863US8906175B2Room temperature bonding apparatusKINOUCHI MASATO·Filed 2009·Granted Dec 9, 2014·2 cites·11 claims
- 0960US9064910B2Bonding unit control unit and multi-layer bonding methodKINOUCHI MASATO·Filed 2010·Granted Jun 23, 2015·1 cites·7 claims
- 1060US8857487B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2008·Granted Oct 14, 2014·1 cites·13 claims
- 1158US8985175B2Room temperature bonding machine and room temperature bonding methodKINOUCHI MASATO·Filed 2008·Granted Mar 24, 2015·1 cites·4 claims
- 1252US8201578B2Oil panSUZUKI TAKENORI·Filed 2009·Granted Jun 19, 2012·3 cites·8 claims
- 1352US6589319B2Canister having liquefied fuel treating functionTOYO ROKI SEIZO KK·Filed 2001·Granted Jul 8, 2003·6 cites·5 claims
- 1446US9005390B2Room temperature bonding apparatusTSUNO TAKESHI·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 1546US4041009AProcess for producing anti-blocking and low pressure moldable diallyl phthalate resin molding materialsFUJITSU LTD·Filed 1976·Granted Aug 9, 1977·6 cites·6 claims
- 1646US2013147126A1Seal memberROKI CO LTD·Filed 2012·Application pending·0 cites
- 1745US2017162428A1Room-temperature bonding apparatusMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2014·Application pending·0 cites
- 1843US9580306B2Room temperature bonding apparatus and room temperature bonding methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2013·Granted Feb 28, 2017·0 cites·16 claims
- 1941US2015249026A1Room-temperature bonding apparatus and room-temperature bonding methodMITSUBISHI HEAVY IND LTD·Filed 2013·Application pending·0 cites
- 2041US2006169632A1Filter elementTOYO ROKI SEIZO KK·Filed 2006·Application pending·0 cites
- 2140US10486263B2Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor deviceMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2015·Granted Nov 26, 2019·0 cites·9 claims
- 2236US2019172813A1Substrate joining methodMITSUBISHI HEAVY IND MACHINE TOOL CO LTD·Filed 2017·Application pending·0 cites
- 2332US2012247645A1Bonding method, bonding apparatus, and bonding systemTSUTSUMI KEIICHIRO·Filed 2010·Application pending·0 cites
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