Inventor · disambiguated record

Chung-Yang Tseng

Also filed as: TSENG CHUNG-YANG

2 granted patents·12 citations·filing 2002–2003

50Inventor score

Technology areasH10P

Files withASIA PACIFIC MICROSYSTEMS INC2

Top patents by PatentIndex Score

2 records

0159US6967145B2Method of maintaining photolithographic precision alignment after wafer bonding processASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted Nov 22, 2005·12 cites·4 claims
0231US6864176B2Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement methodASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Granted Mar 8, 2005·0 cites·8 claims

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