Assignee
ASIA PACIFIC MICROSYSTEMS INC
TW·18 granted patents·10 pending applications·338 citations·filing 2002–2025
Top patents by PatentIndex Score
28 records- 0191US6924583B2Film bulk acoustic device with integrated tunable and trimmable deviceASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Granted Aug 2, 2005·95 cites·11 claims
- 0290US6996306B2Electrostatically operated micro-optical devices and method for manufacturing thereofASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted Feb 7, 2006·57 cites·18 claims
- 0390US6784020B2Package structure and method for making the sameASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Granted Aug 31, 2004·88 cites·63 claims
- 0486US9459172B2Diaphragm piezoresistive pressure sensorASIA PACIFIC MICROSYSTEMS INC·Filed 2014·Granted Oct 4, 2016·11 cites·16 claims
- 0581US10156489B2Piezoresistive pressure sensorASIA PACIFIC MICROSYSTEMS INC·Filed 2017·Granted Dec 18, 2018·5 cites·19 claims
- 0680US6804036B1Optical switchASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted Oct 12, 2004·23 cites·19 claims
- 0773US6703763B2Bulk acoustic wave multiplexerASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Granted Mar 9, 2004·16 cites·13 claims
- 0869US7824945B2Method for making micro-electromechanical system devicesASIA PACIFIC MICROSYSTEMS INC·Filed 2008·Granted Nov 2, 2010·10 cites·17 claims
- 0964US9359193B2Method for manufacturing an integrated MEMS deviceASIA PACIFIC MICROSYSTEMS INC·Filed 2014·Granted Jun 7, 2016·1 cites·14 claims
- 1062US6838303B2Silicon pressure sensor and the manufacturing method thereofASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted Jan 4, 2005·12 cites·7 claims
- 1161US8916449B2Package structure and substrate bonding methodASIA PACIFIC MICROSYSTEMS INC·Filed 2013·Granted Dec 23, 2014·2 cites·8 claims
- 1259US6967145B2Method of maintaining photolithographic precision alignment after wafer bonding processASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted Nov 22, 2005·12 cites·4 claims
- 1358US2026036473A1Stress sensing element having diaphragm with vertical protrusionsASIA PACIFIC MICROSYSTEMS INC·Filed 2025·Application pending·0 cites
- 1457US6901182B2Retro-reflective type optical signal processing device and methodASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Granted May 31, 2005·6 cites·9 claims
- 1555US9676609B2Integrated MEMS deviceASIA PACIFIC MICROSYSTEMS INC·Filed 2016·Granted Jun 13, 2017·0 cites·20 claims
- 1648US12402243B2Circuit carrier boardASIA PACIFIC MICROSYSTEMS INC·Filed 2023·Granted Aug 26, 2025·0 cites·15 claims
- 1742US2004086218A1Apparatus and method for optical signal processing systemASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Application pending·0 cites
- 1841US2005274442A1Wireless tire pressure and temperature monitoring systemASIA PACIFIC MICROSYSTEMS INC·Filed 2004·Application pending·0 cites
- 1940US2004037493A1Optical signal processing apparatus based on movable tilted reflection mirrorASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Application pending·0 cites
- 2039US2013205899A1Combo Transducer and Combo Transducer PackageASIA PACIFIC MICROSYSTEMS INC·Filed 2013·Application pending·0 cites
- 2135US2002189062A1Manufacturing method for a high quality film bulk acoustic wave deviceASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Application pending·0 cites
- 2234US2004063039A1Method for inductor trimming of the high frequency integrated passive devicesASIA PACIFIC MICROSYSTEMS INC·Filed 2003·Application pending·0 cites
- 2333US2004007940A1Thin film acoustic wave device and the manufacturing method thereofASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Application pending·0 cites
- 2433US2003000058A1Method for manufacturing a film bulk acoustic wave filterASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Application pending·0 cites
- 2532US9382113B2Method for fabricating a self-aligned vertical comb drive structureASIA PACIFIC MICROSYSTEMS INC·Filed 2013·Granted Jul 5, 2016·0 cites·15 claims
- 2631US9553055B2Method for fabricating semiconductor devices having reinforcing elementsASIA PACIFIC MICROSYSTEMS INC·Filed 2015·Granted Jan 24, 2017·0 cites·18 claims
- 2731US6864176B2Fabrication process for bonded wafer precision layer thickness control and its non-destructive measurement methodASIA PACIFIC MICROSYSTEMS INC·Filed 2002·Granted Mar 8, 2005·0 cites·8 claims
- 2826US2015279664A1Method for fabricating semiconductor devices having high-precision gapsASIA PACIFIC MICROSYSTEMS INC·Filed 2015·Application pending·0 cites
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