Inventor · disambiguated record
Susanne Klaudia Duch
Also filed as: DUCH SUSANNE · DUCH SUSANNE K · DUCH SUSANNE KLAUDIA
3 granted patents·8 pending applications·4 citations·filing 2014–2025
56Inventor score
Files withHERAEUS DEUTSCHLAND GMBH & CO KG9HERAEUS ELECTRONICS GMBH & CO KG1HERAEUS MATERIALS TECH GMBH1
Top patents by PatentIndex Score
11 records- 0185US10144095B2Sinter paste with coated silver oxide on noble and non-noble surfaces that are difficult to sinterHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Granted Dec 4, 2018·2 cites·14 claims
- 0275US2023395552A1Metal sintering preparation and the use thereof for the connecting of componentsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2023·Application pending·0 cites
- 0374US2025210573A1Metal sintering preparation and the use thereof for the connecting of componentsHERAEUS ELECTRONICS GMBH & CO KG·Filed 2025·Application pending·0 cites
- 0470US10622331B2Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic componentHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Granted Apr 14, 2020·2 cites·11 claims
- 0566US2021276085A1Metal sintering preparation and the use thereof for the connecting of componentsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2021·Application pending·0 cites
- 0662US2017326640A1Metal sintering preparation and the use thereof for the connecting of componentsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Application pending·0 cites
- 0747US2016059361A1Sinter paste with coated silver oxide on noble and non-noble surfaces that are difficult to sinterHERAEUS MATERIALS TECH GMBH·Filed 2014·Application pending·0 cites
- 0844US2020156155A1Method for connecting components by means of a metal pasteHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Application pending·0 cites
- 0942US11045910B2Metal paste and use thereof for joining componentsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Granted Jun 29, 2021·0 cites·13 claims
- 1039US2017194169A1Method for applying dried metal sintering compound by means of a transfer substrate onto a carrier for electronic components, corresponding carrier, and the use thereof for sintered connection to electronic componentsHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2014·Application pending·0 cites
- 1134US2020147696A1Method for connecting components by means of a metal pasteHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →