Inventor · disambiguated record
Serge Jaunay
Also filed as: JAUNAY SERGE · JAUNAY SERGE ROBERT
3 granted patents·81 citations·filing 2004–2010
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0182US7394150B2Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 1, 2008·35 cites·17 claims
- 0282US7238551B2Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 3, 2007·37 cites·18 claims
- 0380US8586419B2Semiconductor packages including die and L-shaped lead and method of manufactureJAUNAY SERGE·Filed 2010·Granted Nov 19, 2013·9 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →