Inventor · disambiguated record

Yonglk Choi

Also filed as: CHOI YONGLK

1 granted patent·0 citations·filing 2024–2024

13Inventor score

Technology areasH10W

Files withAVAGO TECH INT SALES PTE LID1

Top patents by PatentIndex Score

1 record

0172US12489042B2Device having solder bump structure for improved mechanical, electrical, and/or thermal performanceAVAGO TECH INT SALES PTE LID·Filed 2024·Granted Dec 2, 2025·0 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →