Inventor · disambiguated record
He Chen
Also filed as: CHEN HE · CHEN HE-CHEN
11 granted patents·12 pending applications·24 citations·filing 2009–2024
85Inventor score
Top patents by PatentIndex Score
23 records- 0187US10840125B2Memory structure and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Nov 17, 2020·6 cites·18 claims
- 0283US10497708B1Memory structure and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 3, 2019·4 cites·20 claims
- 0379US12033966B2Contact pads of three-dimensional memory device and fabrication method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 9, 2024·1 cites·17 claims
- 0478US9498017B2Power generation device and shoe equipment having power generation deviceLIN CHE WEI·Filed 2014·Granted Nov 22, 2016·9 cites·15 claims
- 0571US9915778B2LED lamp strip structure and control method thereof, backlight module, liquid crystal display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2015·Granted Mar 13, 2018·2 cites·17 claims
- 0671US2025015015A1Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0770US2023380142A1Memory devices having vertical transistors and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 0866US12136599B2Three-dimensional memory devices and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·18 claims
- 0966US2024268119A1Method for fabricating three-dimensional semiconductor device using buried stop layer in substrateYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1065US2023335521A1Three-dimensional nand memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1163US8289255B2Electro-optical apparatus and display thereofCHEN HE-CHEN·Filed 2009·Granted Oct 16, 2012·2 cites·16 claims
- 1262US2025151257A1Semiconductor devices and fabrication methods thereof, and memory systemsYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1360US11956958B2Method for fabricating three-dimensional semiconductor device using buried stop layer in substrateYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 1460US11710730B2Fabricating method of semiconductor device with exposed input/output pad in recessYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·8 claims
- 1559US11728303B2Three-dimensional NAND memory device and method of forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·13 claims
- 1657US2025280545A1Word line protection method in the backside process of a vertical dynamic random access memory (dram) deviceYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1755US2024049455A1Memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 1853US11430775B2Semiconductor device with exposed input/output pad in recessYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Aug 30, 2022·0 cites·11 claims
- 1953US2024196589A1Memory device and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2051US2024188275A1Memory device and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Application pending·0 cites
- 2150US2023371244A1Memory device having vertical transistors and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2236US2011298779A1Electrophoretic Device and Driving Method ThereofCHEN HE-CHEN·Filed 2011·Application pending·0 cites
- 2334US2014292130A1Heterogeneous motorCHEN HE·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →