Inventor · disambiguated record

Hakan Bygdo

Also filed as: BYGDO HAKAN · BYGDOE HAAKAN

1 granted patent·1 pending application·1 citations·filing 2001–2007

16Inventor score

Technology areasH05K

Files withSONY ERICSSON MOBILE COMM AB1

Top patents by PatentIndex Score

2 records

0152US7965520B2Electronic device with flip module having low heightSONY ERICSSON MOBILE COMM AB·Filed 2007·Granted Jun 21, 2011·1 cites·8 claims
0216US2002040808A1Method of making a gasket on a PCB and a PCBFiled 2001·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →