Inventor · disambiguated record
Jung Hyung Lee
Also filed as: LEE JUNG HYUNG
7 granted patents·2 pending applications·19 citations·filing 2010–2021
77Inventor score
Top patents by PatentIndex Score
9 records- 0185US9027700B2Bonding structure of diaphragm for microspeakerEM TECH CO LTD·Filed 2013·Granted May 12, 2015·10 cites·10 claims
- 0284US8999862B1Methods of fabricating nano-scale structures and nano-scale structures fabricated therebySK HYNIX INC·Filed 2014·Granted Apr 7, 2015·7 cites·20 claims
- 0364US9185477B2Suspension for sound transducerEM TECH CO LTD·Filed 2013·Granted Nov 10, 2015·2 cites·9 claims
- 0453US9086632B2Fine pattern structures having block co-polymer materials and methods of fabricating the sameSK HYNIX INC·Filed 2014·Granted Jul 21, 2015·0 cites·19 claims
- 0550US9840059B2Fine pattern structures having block co-polymer materialsSK HYNIX INC·Filed 2015·Granted Dec 12, 2017·0 cites·12 claims
- 0645US2015208172A1Microspeaker Diaphragm Bonding StructureEM TECH CO LTD·Filed 2015·Application pending·0 cites
- 0740US11651962B2Method of forming patterns using reverse patternsSK HYNIX INC·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 0836US2011256723A1Method for forming semiconductor deviceHYNIX SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 0933US9721795B2Methods of forming patterns having different shapesSK HYNIX INC·Filed 2015·Granted Aug 1, 2017·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →