Inventor · disambiguated record
Scott M. Mokler
Also filed as: MOKLER SCOTT · MOKLER SCOTT M
7 granted patents·5 pending applications·18 citations·filing 2015–2023
78Inventor score
Files withINTEL CORP12
Top patents by PatentIndex Score
12 records- 0193US11923257B2Hybrid microelectronic substratesINTEL CORP·Filed 2021·Granted Mar 5, 2024·2 cites·18 claims
- 0287US10548249B2Shielding in electronic assembliesINTEL CORP·Filed 2017·Granted Jan 28, 2020·10 cites·24 claims
- 0379US10159152B2Development of the advanced component in cavity technologyINTEL CORP·Filed 2015·Granted Dec 18, 2018·4 cites·11 claims
- 0474US11114353B2Hybrid microelectronic substratesINTEL CORP·Filed 2016·Granted Sep 7, 2021·2 cites·20 claims
- 0565US2025089312A1Gate-all-around integrated circuit structures having differential nanowire thickness and gate oxide thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 0659US11444033B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2020·Granted Sep 13, 2022·0 cites·19 claims
- 0759US2025210460A1Transistor performance improvement for stacked devices using selective front and backside contact metalsINTEL CORP·Filed 2023·Application pending·0 cites
- 0858US2025221017A1Hv transistors & resistors for stacked transistor architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 0957US2025113561A1Stacked transistors with strain materials on source and drainINTEL CORP·Filed 2023·Application pending·0 cites
- 1047US10763215B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2015·Granted Sep 1, 2020·0 cites·7 claims
- 1136US2019221456A1Selective and multilevel solder paste pin transferINTEL CORP·Filed 2018·Application pending·0 cites
- 1235US10716214B2Hybrid microelectronic substrate and methods for fabricating the sameINTEL CORP·Filed 2015·Granted Jul 14, 2020·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →