Inventor · disambiguated record
Kwei-Kuan Kuo
Also filed as: KUO KWEI-KUAN
3 granted patents·1 pending application·3 citations·filing 2009–2014
52Inventor score
Top patents by PatentIndex Score
4 records- 0158US8125074B2Laminated substrate for an integrated circuit BGA package and printed circuit boardsSLAVOV NEDYALKO·Filed 2009·Granted Feb 28, 2012·3 cites·13 claims
- 0245US2011064362A1Integrated circuit device or package and integrated circuit system, with an optical wave-guide elementST ERICSSON SA·Filed 2009·Application pending·0 cites
- 0340US8222722B2Integrated circuit package and deviceSLAVOV NEDYALKO·Filed 2009·Granted Jul 17, 2012·0 cites·21 claims
- 0431US9972561B2QFN package with grooved leadsSUZHOU ASEN SEMICONDUCTORS CO LTD·Filed 2014·Granted May 15, 2018·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →